New Electronic World Order


By Frank Ferro Analysts agree that much of the semiconductor growth over the next few years will be in the mobile market segments—smart phones, tablets and ultra-books, in particular. At the recent CES, there was no lack of these devices on display, all which are competing to cash in on the cachet that Apple has developed around these products. Although ultra-books will eventually just be no... » read more

Looking Back To The Future


By Frank Ferro As I'm reading through year-end articles on the top technologies of 2011, along with predictions of what's hot for 2012, I naturally start to reflect on the emerging technologies for the year ahead—and will anyone see them coming? Undoubtedly this was another year where rapid technology adoption changed our behavior throughout the day. It was the year of the tablet, the sma... » read more

Make Vs. Buy


By Ann Steffora Mutschler The confounding ‘make versus buy’ decision is understandably muddled by design complexity. Millions of gates, thousands of blocks, dozens of cores, plus software, packaging, and worries about physical effects don’t make this decision any easier. In some cases the process can be simplified by mandating that anything that doesn’t add differentiation really is... » read more

Build It Faster


By Ed Sperling Hitting market windows with IC designs has always been a struggle, but the race to the finish line is becoming more critical—and much more difficult. The reason: Market windows themselves are shrinking. Products that used to stick around for years may now only last for months, replaced by newer versions that offer either better performance or lower power. In many cases, par... » read more

A Secret Weapon


By John Bainbridge One of the major advances in SoC design methodologies more than a decade ago was the decoupling of the network-on-chip (NoC) from the individual IP cores throughout the SoC. This was (and is) accomplished through the use of carefully specified sockets such as OCP, the old VSIA VCI and (somewhat later) AMBA-AXI, which establish clear boundaries of communication responsibility... » read more

VIP: Behind The Velvet Rope


By Ann Steffora Mutschler Some years ago, as engineering teams began to incorporate more protocols into designs and as those protocols grew in sophistication and complexity in order to deliver additional performance, the verification task grew concurrently. At the same time, the design IP market was growing as complexity drove re-use of components, along with verification components—most com... » read more

eDRAM: No Brainer…But No Takers?


By Steve Hamilton Designers in the consumer electronics market—mobile in particular—are constantly looking for new ways to reduce cost and power while increasing performance. This is far from novel. With consumers’ unrelenting demand for more features at lower prices, you would think semiconductor companies would jump when confronted with a technology that gives them a real competitive e... » read more

The High-Speed Virtual Highway


By Frank Ferro By now it’s safe to say that complex, high-speed design is no longer a riddle….at least in theory. We all know the end game. In its most fundamental form, isn’t it really a designer’s negotiation and compromise with the end user that comes down to action and reaction? We know users demand more and more applications to run simultaneously on their smart devices. We know... » read more

Executive Briefing: 3D IC Stacking Challenges


Sonics CEO Grant Pierce sounds off on the challenges of stacking die, what has to change and why. [youtube vid=wCseVs738LQ] » read more

Will Wide I/O Reduce Cache?


By Ann Steffora Mutschler In an ideal world, all new SoC technologies would make the lives of design engineers easier. While this may be true of some techniques, it is not the case with one advanced memory interface technology on the horizon, Wide I/O. There are claims that Wide I/O could reduce cache, but so far this is not widely understood. In fact, exactly how Wide I/O will be used, wha... » read more

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