tag: SPIL

The Week In Review: Manufacturing
By Mark LaPedus - 04 May, 2018 - Comments: 0

Chipmakers Consumers recently filed a class-action suit against the three DRAM makers, alleging that they illegally agreed to raise prices for their respective memory products. The suit, filed in the U.S. District Court for the Northern District of California, alleges that Samsung, Micron and Hynix agreed to limit the supply of DRAM, driving up prices for this widely used memory. The pri... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 Jan, 2018 - Comments: 0

Chipmakers The IC industry continues to consolidate. For example, Qualcomm has a proposed plan to buy NXP. And then, Broadcom wants to buy Qualcomm. Who is next? In a research note, RBC Capital Markets analyst Mitch Steves said: “According to Bloomberg, Microsemi is exploring a sale and we think logical acquirers could include Skyworks. We continue to view Microsemi as a notable strategic as... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Jul, 2017 - Comments: 0

Chipmakers UMC has generated sales from its recently-announced 14nm finFET technology. The foundry vendor also plans to enter the 22nm process technology market. UMC will join other players in the 22nm arena, such as GlobalFoundries, Intel and TSMC. “So we do have a plan to introduce our 22nm as well and it will be available around 2018,” said Jason Wang, the newly appointed co-president o... » read more

What Next For OSATs
By Mark LaPedus - 06 Mar, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss IC-packaging and business trends with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering ([getentity id="22930" comment="ASE"]), the world’s largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What’s the outlook for the IC industry in 2017? Wu:... » read more

OSAT Biz: Growth And Challenges
By Mark LaPedus - 08 Feb, 2017 - Comments: 0

Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

Packaging Wars Begin
By Mark LaPedus - 26 Sep, 2016 - Comments: 1

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

Plotting The Next Semiconductor Road Map
By Ed Sperling - 13 Jun, 2016 - Comments: 0

The semiconductor industry is retrenching around new technologies and markets as Moore's Law becomes harder to sustain and growth rates in smart phones continue to flatten. In the past, it was a sure bet that pushing to the next process node would provide improvements in power, performance and cost. But after 22nm, the economics change due to the need for multi-patterning and finFETs, and th... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 May, 2016 - Comments: 0

Fab tools Thermo Fisher Scientific and FEI have announced that their boards of directors have unanimously approved Thermo Fisher’s acquisition of FEI for $107.50 per share in cash. The transaction represents a purchase price of approximately $4.2 billion. In a video, Aki Fujimura, chief executive of D2S, recaps the emerging mask and lithography trends presented at the recent Photomask Ja... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Apr, 2016 - Comments: 0

Chipmakers IC Insights released its foundry rankings in terms of sales in 2015. TSMC was the leader with $26.4 billion in sales last year. Second ranked GlobalFoundries, which took over IBM’s IC business in 2015, made some gains. With IBM’s chip unit, GlobalFoundries’ quarterly sales in 4Q ‘15 were about $1.4 billion, an annual run-rate of $5.6 billion, about 12% greater than the compa... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Mar, 2016 - Comments: 0

Chipmakers In a blog, GlobalFoundries discussed the global push towards 5G or fifth-generation wireless networks. Samsung Electronics Australia has announced the creation of brainBAND, a wearable technology designed to facilitate research into concussions in sports. In the prototype, a headband houses sensors at the back of the head that measure the force of an impact. This information wou... » read more

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