Designing For Energy Efficiency


Swiss watchmakers have nothing to worry about for the moment. As top-name companies crowd into the wearable market with full-featured watches, limits on battery life and frequent charges undoubtedly will limit their popularity. Smart watches look cool or clunky, depending upon your perspective, but none of them lasts long enough between charges to be a serious market contender. That's certai... » read more

IoT Standards Needed


The promise of the [getkc id="76" comment="Internet of Things"] is effortless communication between devices, all of which are smart enough to transmit data to the Internet directly, or through connecting hubs, and to ad hoc devices that are authorized to be added to a personal or industrial network. What's not yet clear is how that promise will be realized. Even though many devices are desig... » read more

Why Multi-Die Integration Really Is On Its Way


Admit it. You’ve heard a lot about 3D IC’s for years now, and it’s starting to get old. Lots of talk but not much action, you say? Maybe it will never happen, you say? Well, perhaps it’s time to reassess the current situation, reevaluate emerging needs, and reset our “3D” paradigm for the coming multi-die imperative. The problems associated with 3D IC (stacked die) are real and v... » read more

Different Approaches Emerge For Stacking Die


The concept of stacking die to shorten wires, improve performance, and reduce the amount of energy required to drive signals has been in research for at least the past dozen years at both IBM and Intel. And depending upon whom you ask, it could be another 2 to 10 years before it becomes a mainstream packaging approach—if it happens at all. At least part of the confusion stems from how you ... » read more

More People Use Phones Than Toothbrushes…


“Business Has Only Two Functions – Marketing and Innovation” — Milan Kundera There may be more to running a successful business than marketing and innovation, but these two functions were front-and-center at SEMICON West 2014. This year’s industry gathering was an important, and positive, step forward together. Because of the gravity of the challenges facing our industry – funda... » read more

ST Announces 20x Savings Using OpenPDK At DAC


Last month’s Design Automation Conference in San Francisco proved to be highly successful for Si2. This year, for example, Si2 organized 28 member-led presentations, issued 10 press releases, and hosted 5 special events. Today I will focus on one of those events, a special press conference featuring Philippe Magarshack, executive vice president for design enablement services at STMicroelectro... » read more

Accellera Updates UVM Standard


Accellera uncorked its backward-compatible UVM 1.2 standard, which fixes dozens of bugs, including sequences for run-time phasing and support for multithreading. “We’ve solved more than a dozen incompatibilities and improved overall productivity,” said Intel’s Thomas Alsop, who serves as co-chair of the UVM (Universal Verification Methodology) working group. “This is a major releas... » read more

Linux And The Big Bad Wolf


With great interest, I am following any news around the progress of Linaro and the Linux kernel community with regard to addressing all the requirements for an ARMv8 64-bit server software stack. Well-established standards, such as the Unified Extensible Firmware Interface (UEFI) and Advanced Configuration and Power Interface (ACPI), are impacting the development direction of the community b... » read more

Five Disruptive Test Technologies


For years, test has been a critical part of the IC manufacturing flow. Chipmakers, OSATs and the test houses buy the latest testers and design-for-test (DFT) software tools in the market and for good reason. A plethora of unwanted field returns is not acceptable in today’s market. The next wave of complex chips may require more test coverage and test times. That could translate into higher... » read more

What Exactly Is The IoT?


The Internet of Things has drawn its share of attention. It has been overhyped, derided, and in some cases dismissed as the Internet of Silos. But the idea persists, and it’s catching on. So how much substance is there behind the hype? Best guess: Quite a bit. “We do see this as being a fast-growing market,” said Jim Feldhan, president of Semico Research. “The number of connected ... » read more

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