Chip Industry Technical Paper Roundup: Mar. 10


New technical papers recently added to Semiconductor Engineering’s library: [table id=412 /] Find more semiconductor research papers here. » read more

4D mmWave Radar-Based Road Boundary Detection System


A new technical paper titled "Road Boundary Detection Using 4D mmWave Radar for Autonomous Driving" was published by Stanford University. Abstract "Detecting road boundaries, the static physical edges of the available driving area, is important for safe navigation and effective path planning in autonomous driving and advanced driver-assistance systems (ADAS). Traditionally, road boundary de... » read more

Chip Industry Technical Paper Roundup: Mar. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=410 /] Find more semiconductor research papers here. » read more

3D Stacked Device Architecture Enabled By BEOL-Compatible Transistors (Stanford et al.)


A new technical paper titled "Omni 3D: BEOL-Compatible 3-D Logic With Omnipresent Power, Signal, and Clock" was published by researchers at Stanford University, Intel Corporation and Carnegie Mellon University. Abstract "This article presents Omni 3D—a 3-D-stacked device architecture that is naturally enabled by back-end-of-line (BEOL)-compatible transistors. Omni 3D interleaves metal lay... » read more

Chip Industry Week In Review


The chip industry is well on its way to hit $1 trillion in revenue by the end of its decade. Several analyst firms released 2024 annual results and 2025 predictions: Worldwide semiconductor revenue reached $626 billion in 2024, an 18% increase versus 2023, according to preliminary Gartner report. Memory revenue grew about 70%  2024 versus 2023. The firm forecasts that HBM will make up 19%... » read more

Med Tech Morphs Into Consumer Wearables


Doctors have been using advanced technology for years, but the growing trend is for consumers to use devices at home and have direct access to their data. Watches and rings that were once primarily used for counting steps or registering sleep patterns can now read blood pressure, heart rate, blood oxygen, body temperature, and other early signs of illness. Meanwhile, various patches are under d... » read more

Improving GaN Device Architectures


As the universe of applications for power devices grows, designers are finding that no single semiconductor can cover the full range of voltage and current requirements. Instead, combination circuits use different materials for different parts of the overall operating range. GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and... » read more

Chip Industry Technical Paper Roundup: Jan. 20


New technical papers recently added to Semiconductor Engineering’s library: [table id=398 /] Find all technical papers here. » read more

Chip Industry Week In Review


GlobalFoundries will create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. A flurry of announcements on advanced semiconductors and AI rolled out this week as U.S. President Biden wrapped up his term: The Biden-Harris Administration released an Interim Final Rule on Artificial Intelligence Diffusion to strengthen ... » read more

Transformation Of Polarons As Tellurene Becomes Thinner


A new research paper titled "Thickness-dependent polaron crossover in tellurene" was published by researchers from Rice University, Lawrence Berkeley National Laboratory, MIT, Argonne National Laboratory, ORNL, Purdue University, and Stanford University. Abstract "Polarons, quasiparticles from electron-phonon coupling, are crucial for material properties including high-temperature supercond... » read more

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