EDA Looks Beyond Chips

By Ed Sperling - 25 Apr, 2024 - Comments: 0

Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale multi-physics simulations with methodologies and tools that were developed for chips. Top EDA executives have been talking about expanding into adjacent markets for more than a decade, but the broader markets were largely closed to them. In fact, the only significant step in... » read more

Chip Industry Week In Review

By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Research Bits: Apr. 2

By Jesse Allen - 02 Apr, 2024 - Comments: 0

Stretchy, sensitive circuits Researchers from Stanford University developed skin-like, stretchable integrated circuits capable of driving a micro-LED screen with a refresh rate of 60 Hz and detecting a braille array that is more sensitive than human fingertips. The stretchable transistors are made from semiconducting carbon nanotubes sandwiched between soft elastic electronic materials. The... » read more

Research Bits: Feb. 13

By Jesse Allen - 13 Feb, 2024 - Comments: 0

Fast phase-change memory Researchers from Stanford University, TSMC, National Institute of Standards and Technology (NIST), and University of Maryland developed a new phase-change memory for future AI and data-centric systems. It is based on GST467, an alloy of four parts germanium, six parts antimony, and seven parts tellurium, which is sandwiched between several other nanometer-thin material... » read more

Chip Industry Technical Paper Roundup: Feb. 6

By Liz Allan - 06 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=187 /] More ReadingTechnical Paper Library home » read more

A New Phase-Change Memory For Processing Large Amounts Of Data

By Technical Paper Link - 30 Jan, 2024 - Comments: 0

A technical paper titled “Novel nanocomposite-superlattices for low energy and high stability nanoscale phase-change memory” was published by researchers at Stanford University, TSMC, NIST, University of Maryland, Theiss Research and Tianjin University. Abstract: "Data-centric applications are pushing the limits of energy-efficiency in today’s computing systems, including those based on... » read more

Chip Industry Week In Review

By The SE Staff - 05 Jan, 2024 - Comments: 0

By Susan Rambo, Jesse Allen, and Liz Allan The U.S. government will provide about $162 million in federal incentives, under the CHIPS and Science Act, to help Microchip onshore its semiconductor supply chain. The move is aimed at securing a reliable domestic supply of MCUs and mature-node chips. “Today’s announcement will help propel semiconductor manufacturing projects in Colorado and O... » read more

Modeling Compute In Memory With Biological Efficiency

By Katherine Derbyshire - 19 Dec, 2023 - Comments: 0

The growing popularity of generative AI, which uses natural language to help users make sense of unstructured data, is forcing sweeping changes in how compute resources are designed and deployed. In a panel discussion on artificial intelligence at last week’s IEEE Electron Device Meeting, IBM’s Nicole Saulnier described it as a major breakthrough that should allow AI tools to assist huma... » read more

Chip Industry’s Technical Paper Roundup: Dec 11

By Liz Allan - 11 Dec, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=174 /] More ReadingTechnical Paper Library home » read more

How Different Metal Depositions Affect The Structure And Charge Transport Of 9-A Graphene Nanoribbons

By Technical Paper Link - 06 Dec, 2023 - Comments: 0

A technical paper titled “Contact engineering for graphene nanoribbon devices” was published by researchers at University of Arizona, Swiss Federal Labs for Materials Science and Technology, University of California Berkeley, Stanford University, SRM Institute of Science and Technology, Texas A&M University, Lawrence Berkeley National Laboratory (LBNL), Max Planck Institute for Polymer... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Stanford University

EDA Looks Beyond Chips

Chip Industry Week In Review

Research Bits: Apr. 2

Research Bits: Feb. 13

Chip Industry Technical Paper Roundup: Feb. 6

A New Phase-Change Memory For Processing Large Amounts Of Data

Chip Industry Week In Review

Modeling Compute In Memory With Biological Efficiency

Chip Industry’s Technical Paper Roundup: Dec 11

How Different Metal Depositions Affect The Structure And Charge Transport Of 9-A Graphene Nanoribbons