Chip Industry Week in Review


SEMICON West was held in Phoenix this week, with presentations covering heterogeneous integration, AI, quantum, supply chain resilience, and more. Amid the buzz of the conference, some key manufacturing and test announcements were made this week: The strategic importance of the Phoenix area hub was highlighted. Amkor Technology broke ground this week on its advanced packaging and test camp... » read more

Chip Industry Technical Paper Roundup: Oct. 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=480 /] Find more semiconductor research papers here » read more

Chip Industry Startup Funding: Q3 2025


The third quarter of 2025 was dominated by massive rounds for companies developing AI chips and quantum computers. Over $2.5 billion went to AI, with wafer-scale chip maker Cerebras leading the pack with a $1.1 billion raise. While several edge AI companies received backing, the quarter saw a marked shift towards solutions for the data center as firms seek to reduce the cost and power consumpti... » read more

Scaling Nanoribbon Transistors Based on Monolayer 2D Semioconductors (Stanford, HORIBA, SLAC)


A new technical paper titled "Scaling High-Performance Nanoribbon Transistors with Monolayer Transition Metal Dichalcogenides" was published by researchers at Stanford University, HORIBA Scientific, and SLAC National Accelerator Laboratory. Abstract "Nanoscale transistors require aggressive reduction of all channel dimensions: length, width, and thickness. While monolayer two-dimensional se... » read more

Chip Industry Week in Review


The U.S. is considering annual approvals for Samsung and SK hynix to export chipmaking tools and materials to their factories in China, replacing perpetual waivers granted under the validated end user system, reports Bloomberg. The proposal, presented by the U.S. Commerce Department to South Korean officials, would require the companies to reapply each year for specific quantities of restricted... » read more

Chip Industry Technical Paper Roundup: Sept 8


New technical papers recently added to Semiconductor Engineering’s library: [table id=471 /] Find more semiconductor research papers here. » read more

A Fundamental Rethinking Of Memory Hierarchy Design (Stanford University)


A new technical paper titled "The Future of Memory: Limits and Opportunities" was published by researchers at Stanford University and an independent researcher. Abstract "Memory latency, bandwidth, capacity, and energy increasingly limit performance. In this paper, we reconsider proposed system architectures that consist of huge (many-terabyte to petabyte scale) memories shared among large ... » read more

Overview Of The End-to-End Autonomous Driving through V2X Challenge (Tsinghua, HK Univ., Stanford, TU Munich et al.)


A new technical paper titled "Research Challenges and Progress in the End-to-End V2X Cooperative Autonomous Driving Competition" was published by researchers at Tsinghua University, Hong Kong University, Stanford University, TU Munich, Imperial College of London et al. Abstract "With the rapid advancement of autonomous driving technology, vehicle-to-everything (V2X) communication has emerge... » read more

Chip Industry Technical Paper Roundup: July 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=426 /] Find more semiconductor research papers here. » read more

Platform for LN-Based Wavelength-Scale Integrated Phononic Waveguides On Diamond (Stanford, UCSB)


A new technical paper titled "Integrated phononic waveguide on thin-film lithium niobate on diamond" was published by researchers at Stanford University and UC Santa Barbara. Abstract "We demonstrate wavelength-scale phononic waveguides formed by transfer-printed thin-film lithium niobate (LN) on bulk diamond (LNOD), a material stack that combines the strong piezoelectricity of LN with the ... » read more

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