tag: Stanford University

Chip Industry’s Technical Paper Roundup: July 5
By Liz Allan - 05 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Leveraging Quantum Light Within Deployable Quantum Sensors
By Technical Paper Link - 27 Jun, 2023 - Comments: 0

A technical paper titled “Integrated quantum optical phase sensor in thin film lithium niobate” was published by researchers at Stanford University and NTT Research. Abstract: "The quantum noise of light, attributed to the random arrival time of photons from a coherent light source, fundamentally limits optical phase sensors. An engineered source of squeezed states suppresses this noise a... » read more

Chip Industry’s Technical Paper Roundup: June 27
By Liz Allan - 27 Jun, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=113 /]   » read more

Improving Performance Of Artificial Intelligence And Quantum Computers
By Technical Paper Link - 24 Jun, 2023 - Comments: 0

A technical paper titled “Gate-tunable superconducting diode effect in a three-terminal Josephson device” was published by researchers at University of Minnesota, University of California Santa Barbara, and Stanford University. Abstract: "The phenomenon of non-reciprocal critical current in a Josephson device, termed the Josephson diode effect, has garnered much recent interest. Realizati... » read more

Week In Review: Automotive, Security, Pervasive Computing
By Liz Allan - 23 Jun, 2023 - Comments: 0

Stellantis and Foxconn formed a 50/50 joint venture called SiliconAuto, to be headquartered in the Netherlands. The goal is to close the gap between supply and demand for chips used in computer-controlled features and modules, especially for electric vehicles (EVs). The U.S. Department of Justice created a National Security Cyber Section within its National Security Division to increase the ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Jun, 2023 - Comments: 0

Renesas Electronics completed its acquisition of Panthronics, a fabless company specializing in near-field communication (NFC) wireless products. Renesas has already incorporated Panthronics NFC technology into several solution reference designs for applications such as payment, IoT, asset tracking, and smart meters. The European Commission announced new funding for the semiconductor and mic... » read more

Rethinking Engineering Education In The U.S.
By Karen Heyman - 11 May, 2023 - Comments: 8

The CHIPS Act, as well as the ongoing need for talent, is causing both industry and academia in America to rethink engineering education, resulting in new approaches and stronger partnerships. As an example, Arizona State University (ASU) now has a Secure, Trusted, and Assured Microelectronics Center (STAM). The center offers an interdisciplinary approach to learning secure and trusted semic... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 03 Feb, 2023 - Comments: 0

Imec released its semiconductor roadmap, which calls for doubling compute power every six months to handle the data explosion and new data-intensive problems. Imec named five walls (scaling, memory, power, sustainability, cost) that need to be dismantled. The roadmap (below) stretches from 7nm to 0.2nm (2 angstroms) by 2036, and includes four generations of gate-all-around FETs followed by thre... » read more

Chip Industry’s Technical Paper Roundup: Dec. 13
By Linda Christensen - 13 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week.[table id=70 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

Neural Architecture & Hardware Accelerator Co-Design Framework (Princeton/ Stanford)
By Technical Paper Link - 12 Dec, 2022 - Comments: 0

A new technical paper titled "CODEBench: A Neural Architecture and Hardware Accelerator Co-Design Framework" was published by researchers at Princeton University and Stanford University. "Recently, automated co-design of machine learning (ML) models and accelerator architectures has attracted significant attention from both the industry and academia. However, most co-design frameworks either... » read more

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