Managing The Huge Power Demands Of AI Everywhere


Before generative AI burst onto the scene, no one predicted how much energy would be needed to power AI systems. Those numbers are just starting to come into focus, and so is the urgency about how to sustain it all. AI power demand is expected to surge 550% by 2026, from 8 TWh in 2024 to 52 TWh, before rising another 1,150% to 652 TWh by 2030. Commensurately, U.S. power grid planners have do... » read more

Shift Left Is The Tip Of The Iceberg


Shift left is evolving from a buzzword into a much broader shift in design methodology and EDA tooling, and while it's still early innings there is widespread agreement that it will be transformative. The semiconductor industry has gone through many changes over the past few decades. Some are obvious, but others happen because of a convergence of multiple factors that require systemic change... » read more

New AI Data Types Emerge


AI is all about data, and the representation of the data matters strongly. But after focusing primarily on 8-bit integers and 32‑bit floating-point numbers, the industry is now looking at new formats. There is no single best type for every situation, because the choice depends on the type of AI model, whether accuracy, performance, or power is prioritized, and where the computing happens, ... » read more

RISC-V’s Software Portability Challenge


Experts At The Table: RISC-V provides a platform for customization, but verifying those changes remains challenging. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO of Codasip; Neil Hand, director of marketing at Siemens EDA (at the time of this discussion); Frank Schirrmeister, executive director for strategi... » read more

Innovate Faster with A Multi-Die Solution


The semiconductor industry is experiencing a monumental shift in chip design, driven by the dramatic increase in AI compute performance requirements and limitations of Moore’s Law. The industry is adopting multi-die designs, which is the heterogeneous or homogeneous integration of dies (also called chiplets) in a single package. While multi-die design is the solution, it also introduces se... » read more

Power-Aware Test Vector Porting For Production ATE


Power management in contemporary system-on-chip (SoC) designs is almost unimaginably complex. Processors and other chip cores turn on and off as needed. Advanced features such as dynamic voltage and frequency scaling (DVFS) can adjust to changing conditions and incrementally adjust power and performance on the fly. Power management starts from the lowest hardware level of transistor structures ... » read more

Yield Management Embraces Expanding Role


Competitive pressures, shrinking time-to-market windows, and increased customization are collectively changing the dynamics and demands for yield management systems, shifting left from the fab to the design flow and right to assembly, packaging, and in-field analysis. The basic role of yield management systems is still expediting new product introductions, reducing scrap, and delivering grea... » read more

Automotive OEMs Focus On SDVs, Zonal Architectures


Giant automotive OEMs are re-evaluating how quickly to move to advanced technologies and software-driven designs amid crushing financial pressure from low-cost EVs developed in other markets such as China. U.S., European, and Japanese OEMs have been struggling for the past half-decade or so to figure out which is the best approach to developing EVs, undergoing multiple shifts in both hardwar... » read more

PCIe IP With Enhanced Security For The Automotive Market


The automotive industry is undergoing a rapid transformation, with connectivity and automation becoming integral components of modern vehicles. However, this increased connectivity also brings heightened risks. The automotive industry takes many measures to ensure safety for vehicles, but it is crucial to understand that these safety measures are ineffective if the vehicle's security is comprom... » read more

AI Drives IC Design Shifts At The Edge


The increasing adoption of AI in edge devices, coupled with a growing demand for new features, is forcing chipmakers to rethink when and where data gets processed, what kind of processors to use, and how to build enough flexibility into systems to span multiple markets. Unlike in the cloud, where the solution generally involves nearly unlimited resources, computing at the edge has sharp cons... » read more

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