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tag: Synopsys

Week In Review: Design, Low Power
By Jesse Allen - 23 Apr, 2021 - Comments: 0

Skyworks Solutions will acquire Silicon Labs' Infrastructure & Automotive (I&A) business for $2.75 billion cash. The transaction includes Silicon Labs' power/isolation, timing and broadcast products, intellectual property, and approximately 350 employees. Silicon Labs said it will focus on its IoT business, which includes integrated hardware and software wireless platforms for multiple ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 23 Apr, 2021 - Comments: 0

Automotive & transportation Chip shortages continue to affect automotive production lines and the bottom line of automotive OEMs. Jaguar Land Rover and Daimler this week said they will reduce production because chip supply issues. Other car companies have or are planning to temporarily shut down production lines. Renault, GM, Ford, Fiat Chrysler (now Stellantis), Volkswagen, Nissan, and Ho... » read more

Putting Limits On What AI Systems Can Do
By Ed Sperling - 22 Apr, 2021 - Comments: 0

New techniques and approaches are starting to be applied to AI and machine learning to ensure they function within acceptable parameters, only doing what they're supposed to do. Getting AI/ML/DL systems to work has been one of the biggest leaps in technology in recent years, but understanding how to control and optimize them as they adapt isn't nearly as far along. These systems are generall... » read more

Heterogeneous Computing Model Delivers Order-Of-Magnitude Performance Breakthrough
By Samad Parekh - 22 Apr, 2021 - Comments: 0

By Srinivas Kodiyalam (NVIDIA) and Samad Parekh (Synopsys) With the ever-increasing demand for more computing performance, the HPC industry is moving towards a heterogeneous computing model, where GPUs and CPUs work together to perform general-purpose computing tasks. In this heterogeneous computing model, the GPU serves as an accelerator to the CPU, to offload the CPU and to increase comput... » read more

Blog Review: April 21
By Jesse Allen - 21 Apr, 2021 - Comments: 0

Synopsys' Taylor Armerding warns that without making cybersecurity a priority, companies may be positioning themselves as the weak link in the supply chain, and provides some tips for protecting both the company and its customers. Siemens EDA's Simon Favre points to critical area analysis and design for manufacturing as two important strategies to improve IC yield and quality. Cadence's P... » read more

Early, Accurate, Signoff-Correlated Power Analysis
By Synopsys - 21 Apr, 2021 - Comments: 0

Power estimation has always been a fundamental part of semiconductor development, but it has grown in importance in recent years. Virtually every application domain has power limitations that must be satisfied before a chip is fabricated. There is no effective way to fix power issues in the lab or in the field, so pre-silicon estimation must be accurate. The short development cycles for many ty... » read more

Next-Gen Design Challenges
By Ed Sperling - 20 Apr, 2021 - Comments: 0

As more heterogeneous chips and different types of circuitry are designed into one system, that all needs to be simulated, verified and validated before tape-out. Aveek Sarkar, vice president of engineering at Synopsys, talks with Semiconductor Engineering about the intersection of scale complexity and systemic complexity, the rising number of corners, and the reduced margin with which to buffe... » read more

Week In Review: Design, Low Power
By Jesse Allen - 16 Apr, 2021 - Comments: 0

Siemens Digital Industries Software will acquire OneSpin Solutions, a provider of formal verification tools. The company's portfolio of formal tools and apps covers a wide range of design verification, equivalence checking, and functional safety, as well as solutions for trust and security checking. Siemens plants to add OneSpin's technology to the Xcelerator portfolio of verification tools. ... » read more

Debug And Traceability Of MCMs And Chiplets In The Manufacturing Test Process
By Guy Cortez - 16 Apr, 2021 - Comments: 0

Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming larger while silicon geometries continue to get smaller, there is an opportunity to combine even more functionality into a smaller form factor for the end product. Hence, new advancements in desig... » read more

The Quest For Curvilinear Photomasks
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

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