Week in Review: Auto, Security, Pervasive Computing


Automotive and Mobility Search engine giant Baidu said Monday it is the first company to secure permits to operate robotaxis in China without a human safety driver. Baidu’s Apollo and Toyota-backed Pony.ai already operate robotaxis with backup drivers in Beijing. Also this week, smartphone maker Xiaomi said it is running autonomous driving tests on 140 vehicles in China. Xiaomi announced it ... » read more

New Uses For AI In Chips


Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

Signoff-Accurate Partial Layout Extraction And Early Simulation


It is a rewarding experience for EDA developers and users to collaborate on deploying advanced techniques to improve design productivity. This blog will describe the experience of collaborating with customers on a new technology for reducing the number of analog design iterations. Analog design requires that engineers balance the needs to 1) reach market quickly 2) deliver high quality 3) at lo... » read more

Cryogenic CMOS Becomes Cool


Cryogenic CMOS is a technology on the cusp, promising higher performance and lower power with no change in fabrication technology. The question now is whether it becomes viable and mainstream. Technologies often appear to be just on the horizon, not quite making it, but never too far out of sight. That's usually because some issue plagues it, and the incentive is not big enough to solve the ... » read more

Design And Security Challenges for VR


Virtual reality is no longer just for gamers, and as this technology is deployed in everything from health care to industrial training, the requirements for processing more data faster over a high-speed connection are growing. Designing these devices continues to be a study in contradictions. They must be extremely low power, with a small enough batteries to make them comfortable to wear. Bu... » read more

Blog Review: Aug. 10


Siemens' Heather George provides a primer on 3D IC, including the problems it is trying to solve, what differentiates it from other multi-chip technologies, and some of the unique challenges in 3D integration. Cadence's Paul McLellan shares highlights from the Automobil Elektronik Kongress, including how the increasing amount of software in a car is driving disruption in the automotive suppl... » read more

Choosing The Right Photonic Device Design Software


There are many factors to consider before deciding which software to use for photonic device design. To narrow the field, it can be helpful to ask these key questions as you investigate and compare software functionality. • Does the software provide enough flexibility to model and analyze products that offer the best solution to likely and possible design goals? • Is the simulation ca... » read more

Are You Leaving Performance On The Table? Here Is One Sure Way To Find Out


Compute platforms are always hungry for more performance. This is a fact that we simply cannot escape. Whether you are targeting high performance computing, IoT, mobile, or the automotive market, you need to unlock the best performance for your specific workloads. This relentless quest for performance comes with an unwelcome side effect: system complexity. As hardware becomes more capable, the ... » read more

Making The Most Of Data Lakes


Having all the semiconductor data available is increasingly necessary for improving manufacturability, yield, and ultimately the reliability of end devices. But without sufficient knowledge of relationships between data from different processes and computationally efficient data structures, the value of any data is significantly reduced. In the semiconductor industry, reducing waste, decreas... » read more

Synopsys And Cerebras Systems


The Cerebras Systems Wafer-Scale Engine 2 (WSE-2) is by far the largest silicon product available, with a total silicon area of 46,225mm². It utilizes the maximum square of silicon that can be made out of a 300mm diameter wafer. The square of silicon contains 84 die that are 550mm² each. These die were stitched together using proprietary layers of interconnect, making a continuous compute fab... » read more

← Older posts Newer posts →