How The Doubling Of Interconnect Bandwidth With PCI Express 6.0 Impacts IP Electrical Validation


As a result of the innovations taking place in CPUs, GPUs, accelerators, and switches, the interface in hyperscale datacenters now requires faster data transfers both between compute and memory and onto the network. PCI Express (PCIe®) provides the backbone for these interconnects and is used to build protocols such as Computer Express Link (CXL™) and Universal Chiplet Interconnec... » read more

Week In Review: Design, Low Power


Apple plans to spend an additional €1 billion (~$1.1B) over the next six years to expand its Munich, Germany-based Silicon Design Centre, including the construction of a new research facility. "The expansion of our European Silicon Design Centre will enable an even closer collaboration between our more than 2,000 engineers in Bavaria working on breakthrough innovations, including custom sil... » read more

3 Key Automotive Technology Advances To Watch


What we’ve been witnessing in the past few years—particularly with automakers and Tier 1 suppliers investing in software-defined vehicle development—means the automotive industry will grow tremendously both upward in the total number of vehicles as well as horizontally with different innovations in the space coming to fruition. The only way forward is for technology firms and automakers t... » read more

Auto Cyberattacks Becoming More Widespread


As vehicles become smarter, more complex, and increasingly connected, they also become more prone to cyberattacks. The challenge now is to keep pace with hackers, who are continually devising new and innovative ways to attack both software and hardware in vehicles. Recent statistics bear this out. In 2022, there was a big spike in deep/dark web activity and incidents related to application p... » read more

Blog Review: March 1


Siemens EDA's Chris Spear explains the UVM Factory and how it can facilitate collaboration by enabling injection of new features without affecting your team. Cadence's Paul McLellan looks at efforts to ensure chiplets from different companies work together, particularly when the creating companies didn't pre-plan for those specific chiplets to work together, as well as the problems of failur... » read more

How To Build A Rock-Solid Software Security Initiative


Application security testing is the starting block, not the finish line. While a critical component of every security program, the “penetrate and patch” approach is not a strategy. You need a complete program to lower risk exposure, measure progress, and demonstrate results. The most effective AppSec programs—or software security initiatives—are fine-tuned to their respective organiz... » read more

How To Build Resilience Into Chips


Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for continued improvements in performance and power, but it's also contributing to unusual and often unpredictable errors in hardware that are extremely difficult to find. The sources of those errors can include anything from timing errors in a particular sequence, to gaps in bonds between chi... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Ambarella will use Samsung's 5nm process technology for its new CV3-AD685 automotive AI central domain controller, bringing "new levels of AI acceleration, system integration and power efficiency to ADAS and L2+ through L4 autonomous vehicles.” Renesas introduced four technologies for automotive communication gateway SoCs: (1) an architecture that dynamically changes... » read more

Taming Corner Explosion In Complex Chips


There is a tenuous balance between the number of corners a design team must consider, the cost of analysis, and the margins they insert to deal with them, but that tradeoff is becoming a lot more difficult. If too many corners of a chip are explored, it might never see production. If not enough corners are explored, it could reduce yield. And if too much margin is added, the device may not be c... » read more

Leveraging Chip Data To Improve Productivity


The semiconductor ecosystem is scrambling to use data more effectively in order to increase the productivity of design teams, improve yield in the fab, and ultimately increase reliability of systems in the field. Data collection, analysis, and utilization is at the center of all these efforts and more. Data can be collected at every point in the design-through-manufacturing flow and into the f... » read more

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