Addressing IC Reliability Issues Using Eldo

By Mentor, a Siemens Business - 01 May, 2019 - Comments: 0

Advanced, short-geometry CMOS processes are subject to aging that causes major reliability issues that degrade the performance of integrated circuits (ICs) over time. Degradation effects causing aging are hot carrier injection (HCI) and negative bias temperature instability (NBTI), in addition to positive bias temperature instability (PBTI) and time-dependent dielectric breakdown (TDDB). Below ... » read more

Process Variation And Aging

By Ann Mutschler - 17 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss design reliability and circuit aging with João Geada, chief technologist for the semiconductor business unit at ANSYS; Hany Elhak, product management director, simulation and characterization in the custom IC and PCB group at Cadence; Christoph Sohrmann, advanced physical verification at Fraunhofer EAS; and Naseer Khan, vice president of sales at M... » read more

Chip Aging Becomes Design Problem

By Brian Bailey - 09 Aug, 2018 - Comments: 9

Chip aging is a growing problem at advanced nodes, but so far most design teams have not had to deal with it. That will change significantly as new reliability requirements roll out across markets such as automotive, which require a complete analysis of factors that affect aging. Understanding the underlying physics is critical, because it can lead to unexpected results and vulnerabilities. ... » read more

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tag: TDDB

Addressing IC Reliability Issues Using Eldo

Process Variation And Aging

Chip Aging Becomes Design Problem

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