Dealing With Device Aging At Advanced Nodes


Premature aging of circuits is becoming troublesome at advanced nodes, where it increasingly is complicated by new market demands, more stress from heat, and tighter tolerances due to increased density and thinner dielectrics. In the past, aging and stress largely were separate challenges. Those lines are starting to blur for a number of reasons. Among them: In automotive, advanced-node... » read more

The Very Long Road To Autonomous Vehicles


It may be a long wait before fully autonomous vehicles hit the road. Even semi-autonomous vehicles aren't doing so well. The American Automobile Association drove 4,000 miles in cars equipped with active driver assistance, averaging problems every 8 miles. AAA cited a host of problems, including driving too close to other cars or guardrails, aggressive braking, and automated steering that wo... » read more

Improving Reliability For GaN And SiC


Suppliers of gallium nitride (GaN) and silicon carbide (SiC) power devices are rolling out the next wave of products with some new and impressive specs. But before these devices are incorporated in systems, they must prove to be reliable. As with previous products, suppliers are quick to point out that the new devices are reliable, although there are some issues that can occasionally surface... » read more

Addressing IC Reliability Issues Using Eldo


Advanced, short-geometry CMOS processes are subject to aging that causes major reliability issues that degrade the performance of integrated circuits (ICs) over time. Degradation effects causing aging are hot carrier injection (HCI) and negative bias temperature instability (NBTI), in addition to positive bias temperature instability (PBTI) and time-dependent dielectric breakdown (TDDB). Below ... » read more

Process Variation And Aging


Semiconductor Engineering sat down to discuss design reliability and circuit aging with João Geada, chief technologist for the semiconductor business unit at ANSYS; Hany Elhak, product management director, simulation and characterization in the custom IC and PCB group at Cadence; Christoph Sohrmann, advanced physical verification at Fraunhofer EAS; and Naseer Khan, vice president of sales at M... » read more

Chip Aging Becomes Design Problem


Chip aging is a growing problem at advanced nodes, but so far most design teams have not had to deal with it. That will change significantly as new reliability requirements roll out across markets such as automotive, which require a complete analysis of factors that affect aging. Understanding the underlying physics is critical, because it can lead to unexpected results and vulnerabilities. ... » read more