中文 English

Highly Selective Etch Rolls Out For Next-Gen Chips


Several etch vendors are starting to ship next-generation selective etch tools, paving the way for new memory and logic devices. Applied Materials was the first vendor to ship a next-gen selective etch system, sometimes called highly-selective etch, in 2016. Now, Lam Research, TEL, and others are shipping tools with highly-selective etch capabilities, in preparation for futuristic devices su... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Apple has rolled out its most powerful processor, dubbed the M1 Ultra, a multi-die chip that incorporates the company's new packaging technology. The M1 Ultra is incorporated in Apple’s new Mac Studio desktop. M1 Ultra features a 20-core CPU, a 64-core GPU, and a 32-core Neural Engine. The M1 Ultra also features UltraFusion, Apple’s new packaging architecture. M1 Ult... » read more

Week In Review: Manufacturing, Test


Chipmakers Intel has announced a definitive agreement to acquire Tower, a specialty foundry vendor, for approximately $5.4 billion. With the acquisition of Tower, Intel expands its efforts in the foundry business, and put its rivals on notice. With Tower, Intel gains access to mature processes as well as specialty technologies, such as analog, CMOS image sensor, MEMS, power management and RF. ... » read more

Apple’s First GaN Charger


It has been heavily rumored and anticipated for a few years now, but we have finally seen Apple make the switch to using gallium nitride (GaN) as the power transistor in one of their charging products: the 140 W charger for the new 16-inch MacBook Pro. As has been the case with many innovations in the past, Apple may not be the first, but when they do adopt a technology people take notice! A... » read more

Week In Review: Manufacturing, Test


Packaging Amkor plans to build a packaging plant in Bac Ninh, Vietnam. The first phase of the new factory will focus on providing system-in-package (SiP) assembly and test services for customers. The investment for the first phase of the facility is estimated to be between $200 million and $250 million. “This is a strategic, long-term investment in geographical diversification and factory... » read more

A Look Inside The Apple iPhone 13 Pro


By Stacy Wegner, Daniel Yang, and Ziad Shukry We received the iPhone 13 and iPhone 13 Pro in our labs and identification and early costing analysis are available below. The phone models we are discussing today are the Apple iPhone 13 Pro, model A2636, 256GB and the Apple iPhone 13, model A2631 256GB. Apple iPhone 13 Pro cost analysis We have completed the QTT cost analysis and estimate ... » read more

Week In Review: Design, Low Power


Nvidia acquired Oski Technology. Oski provides formal verification methodologies and consulting services, and Nvidia said that the acquisition will allow it to increase its investment in formal verification strategies. Oski's Gurugram, India, design center will become Nvidia's fourth engineering office in the country. Based in San Jose, Calif., it was founded in 2005. Terms of the deal were not... » read more

Will The Fitbit Charge 5 Outshine The Fitbit Luxe?


We don’t know, and we do not comment on whether one device is better than its previous generation. What we do is look at and compare generations of devices. And while we wait for our pre-order of our Fitbit Charge 5 to arrive, we will take a look at what Fitbit Luxe has inside of it. Fig. 1: Fitbit Luxe. Fig. 2: Fitbit Inspire 2. The Luxe has other changes from the Inspire 2, inc... » read more

Week In Review: Design, Low Power


Tools Cadence teamed up with Tower Semiconductor to release a silicon-validated SP4T RF SOI switch reference design flow using the Cadence Virtuoso Design Platform and RF Solution. The reference design flow targets advanced 5G wireless, wireline infrastructure, and automotive IC product development and include a set of mixed-signal and RF design, simulation, system analysis and signoff tools t... » read more

Micron B47R 3D CTF CuA NAND Die, World’s First 176L (195T)


Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process, structure, and die design. Micron 176L 3D NAND is one of the most groundbreaking technologies to date, and it is especially for the storage application such as data center, 5G, AI, cloud, intelligent edge, and mobile devices. Mi... » read more

← Older posts