Chip Industry’s Technical Paper Roundup: Oct 18


New technical papers added to Semiconductor Engineering’s library this week. [table id=57 /] » read more

Technical Paper Roundup: Sept 27


New technical papers added to Semiconductor Engineering’s library this week. [table id=53 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Technical Paper Roundup: Sept. 12


New technical papers added to Semiconductor Engineering’s library this week. [table id=51 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Technical Paper Round-Up: April 5


Neuromorphic chips, transistor defect detection, quantum, pellicles, BEV mobile charging, copper wire bonding, LrWPAN, batteries and superconductivity top the past week's technical papers. They also point to a rising level of government investment, and collaborations between schools that historically haven't worked closely together, including one that involves schools on different continents. ... » read more

Technical Paper Round-Up: March 22


New memories, materials, and transistor types, and processes for making those devices, highlighted the past week's technical papers. That includes everything from vertical MoS2 to programmable black phosphorus image sensors and photonic lift-off processes for flexible thin-film materials. Papers continue to flow from all parts of the supply chain, with some new studies out of Pakistan, Seoul... » read more

Technical Paper Round-Up: March 15


Research is expanding across a variety of semiconductor-related topics, from security to flexible substrates and chiplets. Unlike in the past, when work was confined to some of the largest universities, that research work is now being spread across a much broader spectrum of schools on a global basic, including joint research involving schools whose names rarely appeared together. Among the ... » read more

Technical Papers: Organized, Timely, And Relevant


Engineers and scientists from every discipline linked to semiconductors have been struggling for years to find good research papers about trends and topics they care about, and the situation is only getting worse as the technology becomes more complex and the supply chain becomes more diverse and distributed. There are a slew of new issues in manufacturing, packaging, and design, and there a... » read more

DAC Is Starting To Heat Up


As we reach the midpoint of summer, it’s time to kick back and enjoy vacation and the sunshine. But don’t get too relaxed, because paper submissions are just around the corner. Turning up the temperature on paper submissions Last week I introduced you to DAC’s two technical program co-chairs Sharon Hu and Rob Aitken. They lead our technical program committee, a world-wide volunteer n... » read more

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