Mapping and Routing Fault-Tolerant Quantum Circuits Onto Chiplet Architectures (TU Munich)


A new technical paper, "Chipmunq: A Fault-Tolerant Compiler for Chiplet Quantum Architectures," was published by researchers at the Technical University of Munich. Abstract "As quantum computing advances toward fault-tolerance through quantum error correction, modular chiplet architectures have emerged to provide the massive qubit counts required while overcoming fabrication limits of mon... » read more

Chip Industry Week in Review


Intel hired ex-Qualcomm GPU guru Eric Demers for the company's high-performance GPU push, setting the stage for a three-way battle with Nvidia and AMD. The key targets for Intel and AMD will be better power efficiency and a programming model that rivals CUDA, but don't expect Nvidia to stand still. Acquisitions Texas Instruments plans to acquire Silicon Labs for ~$7.5B cash to enhance i... » read more

Chip Industry Technical Paper Roundup: Sept 8


New technical papers recently added to Semiconductor Engineering’s library: [table id=471 /] Find more semiconductor research papers here. » read more

Overview of Incorporating LLMs into EDA, With 3 Case Studies (TU Munich et al.)


A new technical paper titled "Large Language Models (LLMs) for Electronic Design Automation (EDA)" was published by researchers at the Technical University of Munich, University of Stuttgart, New York University, and University of Siegen. Abstract "With the growing complexity of modern integrated circuits, hardware engineers are required to devote more effort to the full design-to-manufactu... » read more

Mixed-Criticality SW Architectures for Centralized HPC Platforms in Software-Defined Vehicles (Daimler, TU Munich)


A new technical paper titled "Towards Mixed-Criticality Software Architectures for Centralized HPC Platforms in Software-Defined Vehicles: A Systematic Literature Review" was published by researchers at Daimler Truck AG and Technical University of Munich. Abstract "Centralized electrical/electronic architectures and High-Performance Computers (HPCs) are redefining automotive software develo... » read more

Research Bits: June 3


Imaging power electronics Researchers from the Institute of Science Tokyo, Harvard University, and Hitachi used diamond quantum sensors to analyze the magnetization response of soft magnetic materials used in power electronics. The method can simultaneously image both the amplitude and phase of AC stray fields over a wide frequency range up to 2.3 MHz. It uses a diamond quantum sensor with ... » read more

Chip Industry Week in Review


Podcast: imec's roadmap and a one-on-one interview with the European research house's chief strategy officer. China's Xiaomi debuted an in-house-designed 10-core mobile SoC built on a 3nm process. The company did not identify the foundry. It also announced plans to invest 50 billion yuan (~$7B) over the next decade to develop high-end smartphone chips, as part of a 200 billion yuan (~$28B) c... » read more

Chip Industry Technical Paper Roundup: Mar. 10


New technical papers recently added to Semiconductor Engineering’s library: [table id=412 /] Find more semiconductor research papers here. » read more

Field-Coupled Nanocomputing: Scalable And Efficient Post-Layout Optimization (TU Munich)


A new technical paper titled "Efficient and Scalable Post-Layout Optimization for Field-coupled Nanotechnologies" was published by researcher at the Technical University of Munich (TUM). Abstract "As conventional computing technologies approach their physical limits, the quest for increased computational power intensifies, heightening interest in post-CMOS technologies. Among these, Field... » read more

Chip Industry Week In Review


The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from: imec: Proposed a new CFET-based standard cell architecture for the A7 node containing two rows of CFETs with a shared signal routing wall in between, allowing standard cell heights to be reduced from 4 to 3.5T, compared to single-row CFETs. Integrated indium pho... » read more

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