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Quantum Research Bits: Sept. 12


Making Qubits Last Longer One of the big challenges in quantum computing is extending the lifespan of qubits, called coherence time, long enough to do something useful with them. Research is now focused on how to increase that usable lifetime, and what factors can impact that. This has led to very different conclusions about whether silicon is a good substrate choice for quantum chips. Rese... » read more

Research Bits: Aug. 30


Through glass vias Researchers from the Chinese Academy of Sciences (CAS) developed a Through Glass Via (TGV) process for 3D advanced packaging, which they say enables low transmission loss and high vacuum wafer-level packaging of high-frequency chips and MEMS sensors. TGV is a vertical interconnection technology applied in wafer-level vacuum packaging. The researchers found that it has goo... » read more

Technical Paper Roundup: Aug. 30


New technical papers added to Semiconductor Engineering’s library this week. [table id=47 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Training a Quantum Neural Network Requires Only A Small Amount of Data


A new research paper titled "Generalization in quantum machine learning from few training data" was published by researchers at Technical University of Munich, Munich Center for Quantum Science and Technology (MCQST), Caltech, and Los Alamos National Lab. “Many people believe that quantum machine learning will require a lot of data. We have rigorously shown that for many relevant problems,... » read more

Technical Paper Round-Up: March 22


New memories, materials, and transistor types, and processes for making those devices, highlighted the past week's technical papers. That includes everything from vertical MoS2 to programmable black phosphorus image sensors and photonic lift-off processes for flexible thin-film materials. Papers continue to flow from all parts of the supply chain, with some new studies out of Pakistan, Seoul... » read more

E/E Architecture Synthesis: Challenges and Technologies


ACADEMIC PAPER Abstract "In recent years, the electrical and/or electronic architecture of vehicles has been significantly evolving. The new generation of cars demands a considerable amount of computational power due to a large number of safety-critical applications and driver-assisted functionalities. Consequently, a high-performance computing unit is required to provide the demanded pow... » read more

Week In Review: Design, Low Power


Intellectual Property Flex Logix inked an agreement with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) covering any Flex Logix IP technology for use in all US Government-funded programs for research and prototyping purposes with no license fees. “Our first license with AFRL for EFLX eFPGA in GlobalFoundries 12nm process was highly successful, with more than a half dozen pr... » read more

The Wiretap Channel for Capacitive PUF-Based Security Enclosures


Abstract: "In order to protect devices from physical manipulations, protective security enclosures were developed. However, these battery-backed solutions come with a reduced lifetime, and have to be actively and continuously monitored. In order to overcome these drawbacks, batteryless capacitive enclosures based on Physical Unclonable Functions (PUFs) have been developed that generate a key-e... » read more

Power/Performance Bits: Dec. 14


Improved digital sensing Researchers from Imperial College London and Technical University of Munich propose a technique to improve the capability of many different types of sensors. The method addresses voltage limits in analog-to-digital converters and the saturation that results in poor quality when an incoming signal exceeds those limits. “Our new technique lets us capture a fuller ra... » read more

Power/Performance Bits: Oct. 19


Post-quantum crypto chip Researchers at the Technical University of Munich (TUM) designed and had fabricated an ASIC to run new encryption algorithms that can stand up to quantum computing. “Ours is the first chip for post-quantum cryptography to be based entirely on a hardware/software co-design approach,” said Georg Sigl, Professor of Security in Information Technology at TUM. “As a... » read more

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