Week In Review: Design, Low Power

By Jesse Allen - 04 Aug, 2023 - Comments: 0

Qualcomm, NXP, Infineon, Nordic, and Bosch are jointly investing in a new RISC-V company, to be formed in Germany, that will speed up RISC-V’s adoption in commercial products. The company will be “a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry,” according to a press release. The co... » read more

Automatic Extraction of Secrets from the Transistor Jungle using Laser-Assisted Side-Channel Attacks

By Technical Paper Link - 08 Sep, 2021 - Comments: 0

Abstract: "The security of modern electronic devices relies on secret keys stored on secure hardware modules as the root-of-trust (RoT). Extracting those keys would break the security of the entire system. As shown before, sophisticated side-channel analysis (SCA) attacks, using chip failure analysis (FA) techniques, can extract data from on-chip memory cells. However, since the chip's... » read more

Fundamental Changes In Economics Of Chip Security

By Ed Sperling - 10 Jun, 2020 - Comments: 0

Protecting chips from cyberattacks is becoming more difficult, more expensive and much more resource-intensive, but it also is becoming increasingly necessary as some of those chips end up in mission-critical servers and in safety-critical applications such as automotive. Security has been on the semiconductor industry's radar for at least the past several years, despite spotty progress and ... » read more

Manufacturing Bits: March 19

By Mark LaPedus - 19 Mar, 2019 - Comments: 0

Exascale computers Intel and the U.S. Department of Energy (DOE) have set plans to develop and deliver the first exascale supercomputer in the United States. The system, called Aurora, will provide an exaFLOP of performance or a quintillion floating point computations per second. Targeted for delivery in 2021, the system is being developed at DOE’s Argonne National Laboratory. The system ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Technische Universität Berlin

Week In Review: Design, Low Power

Automatic Extraction of Secrets from the Transistor Jungle using Laser-Assisted Side-Channel Attacks

Fundamental Changes In Economics Of Chip Security

Manufacturing Bits: March 19