tag: TEL

Electroplating IC Packages
By Mark LaPedus - 10 Apr, 2017 - Comments: 2

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. [getentity id="22817" e_name="Applied Materials"]  recently rolled out an ECD system for IC packaging. In addition, Lam Research, TEL and others compete in the growing but competitive ECD equipment market for packaging. ECD—sometimes referred to as pl... » read more

Patterning Problems Pile Up
By Mark LaPedus - 20 Mar, 2017 - Comments: 4

Chipmakers are ramping up 16nm/14nm finFET processes, with 10nm and 7nm now moving into early production. But at 10nm and beyond, chipmakers are running into a new set of problems. While shrinking feature sizes of a device down to 10nm, 7nm, 5nm and perhaps beyond is possible using current and future fab equipment, there doesn't seem to be a simple way to solve the edge placement error (EPE)... » read more

Fractilia: Pattern Roughness Metrology
By Mark LaPedus - 21 Feb, 2017 - Comments: 1

A new startup has emerged and unveiled a technology that addresses one of the bigger but less understood problems in advanced lithography--pattern roughness. The startup, called Fractilia, is a software-based metrology tool that analyzes the CD-SEM images of pattern roughness on a wafer. Fractilia, a self-funded startup, is led by Chris Mack and Ed Charrier. Mack, known as the gentleman sc... » read more

BEOL Issues At 10nm And 7nm
By Ed Sperling - 31 Jan, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

BEOL Issues At 10nm And 7nm (part 2)
By Ed Sperling - 04 Jan, 2017 - Comments: 3

Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

Etching Technology Advances
By Jeff Dorsch - 15 Dec, 2016 - Comments: 0

Let’s get really, really small. That directive from leading semiconductor companies and their customers is forcing the whole semiconductor supply chain to come up with new ways to design and manufacture ever-shrinking dimensions for chips. The current push is to 10nm and 7nm, but R&D into 5nm and 3nm is already underway. To put this in perspective, there are roughly two silicon atom... » read more

BEOL Issues At 10nm And 7nm (Part 1)
By Ed Sperling - 15 Dec, 2016 - Comments: 5

Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

BEOL Barricades Ahead
By David Fried - 15 Dec, 2016 - Comments: 0

Coventor recently assembled an expert panel at IEDM 2016, to discuss changes to BEOL process technology that would be needed to continue dimensional scaling to 7 nm and lower. Among the questions posed to panelists: What is BEOL? Where does it begin and end? Are there fundamental limits to interconnect processes? How much longer can we continue to use current interconnect processes and ... » read more

Fab Tool Biz Faces Challenges In 2017
By Mark LaPedus - 15 Dec, 2016 - Comments: 3

After experiencing a gradual recovery and positive growth in 2016, the semiconductor equipment industry sees a mixed picture as well as some uncertainty in 2017. In the near term, though, business is robust. Several chipmakers started to place a sizeable number of fab tool orders in the latter part of 2016, particularly in three areas—3D NAND, logic and foundry. Now, after buying the in... » read more

Lam, KLA-Tencor Scrap Merger
By Mark LaPedus - 05 Oct, 2016 - Comments: 0

After a series of delays due to regulatory issues, Lam Research and KLA-Tencor have agreed to terminate their proposed merger agreement. Last year, Lam entered into a definitive agreement to acquire KLA-Tencor for about $10.6 billion. Lam’s proposed and blockbuster move to acquire KLA-Tencor would supposedly create the world’s second largest fab tool maker, behind Applied Materials. O... » read more

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