tag: TEL

Atomic Layer Etch Finally Emerges
By Mark LaPedus - 15 May, 2014 - Comments: 1

The migration towards finFETs and other devices at the 20nm node and beyond will require a new array of chip-manufacturing technologies. Multiple patterning, hybrid metrology and newfangled interconnect schemes are just a few of the technologies required for future scaling. In addition, the industry also will require new techniques that can process structures at the atomic level. For example... » read more

The Bumpy Road To FinFETs
By Mark LaPedus - 15 May, 2014 - Comments: 2

The shift from planar transistors to finFETs is a major inflection point in the IC industry. FinFETs are expected to enable higher performance chips at lower voltages. And the next-generation transistor technology also could allow the industry to extend CMOS to the 10nm node and perhaps beyond. But as it turns out, finFET technology is also harder to master than previously thought. For exam... » read more

Directed Self-Assembly Gains Momentum
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

Under The Radar At SPIE
By Mark LaPedus - 20 Mar, 2014 - Comments: 2

At the SPIE Advanced Lithography symposium, the best and brightest minds in the lithography, metrology, resist and design-for-manufacturing (DFM) fields assemble for a week. The annual event is a good way to get a pulse on the current state of lithography. At this year’s SPIE, it was simple to get a reading. Extreme ultraviolet (EUV) lithography remains delayed. The other next-generation l... » read more

Advanced Lithography: Moore’s Law Moves On
By Marc David Levenson - 20 Mar, 2014 - Comments: 1

Every February, experts in nano patterning technologies converge in San Jose, Calif., to present their road maps, brainstorms and results at the SPIE Advanced Lithography Symposium. This year, there was more confusion than ever, partly the result of sessions in unlabeled (but beautiful) new ballrooms at the Convention Center, but mostly because of industry divergences. There is no longer a s... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Feb, 2014 - Comments: 0

SPIE Advanced Lithography is a patterning show. At the event, however, Applied Materials revealed more details regarding its selective materials removal opportunity, according to Weston Twigg, an analyst with Pacific Crest Securities, in a research note. Applied Materials presented a paper entitled, “Where Is Plasma Etching Going from Here?” “The presenter outlined concepts for thin layer... » read more

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 07 Feb, 2014 - Comments: 0

This is no surprise, but it could be the end of an era. IBM is exploring a sale of its semiconductor business, according to FT.com. A survey, conducted by Harris Interactive on behalf of Crucial.com, revealed that when asked to choose between these two specific types of men, 84% of women who prefer to be involved with men prefer their male love interest to be "super handy" with computers an... » read more

Week In Review: Manufacturing And Design
By Mark LaPedus - 20 Dec, 2013 - Comments: 0

Wearable computing is one of the hottest topics being discussed today. Angela McIntyre, research director at Gartner, said digital health and fitness will be among the hottest segments in the arena. Don't look now, but ASML Holding has delayed its 450mm tool programs. "As for 450, ASML has paused the development of 450mm lithography systems, both EUV and 193, until customer demand and the ti... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 13 Dec, 2013 - Comments: 0

Tensions between the U.S. and China are growing. In a research report, Gus Richard, an analyst at Piper Jaffray, said: “The technology sector is being impacted by U.S./Chinese tensions over cybersecurity. The combination of Huawei being blocked from doing business in the United States and the Snowden affair are impacting U.S. tech companies' prospects in China. China’s state-run media ident... » read more

DSA, Multi-beam Make Steady Progress
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss current and future lithography challenges with Laurent Pain, lithography lab manager at CEA-Leti. What follows are excerpts of that conversation. SE: CEA-Leti has two major programs in lithography. One is in directed self-assembly (DSA) and the other is in multi-beam e-beam. Let’s start with multi-beam. What is Leti doing in multi-beam and what... » read more

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