tag: Teradyne

Solving Today’s Toughest Test Challenges: A New Era Of Engineering Productivity
By Ed Seng - 11 Nov, 2025 - Comments: 0

Today’s test engineers face unprecedented demands as semiconductor designs grow more complex and product cycles accelerate. Advanced packaging, chiplet architectures, and AI accelerators are reshaping the landscape, yet engineering resources remain fixed. Traditional approaches to scaling productivity by adding headcount no longer apply. While cost of test is always a consideration, ensuri... » read more

Chip Industry Week in Review
By The SE Staff - 07 Nov, 2025 - Comments: 0

SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more

Chip Industry Week in Review
By The SE Staff - 31 Oct, 2025 - Comments: 0

San Francisco-based Substrate raised more than $100 million to build a vertically integrated foundry that uses particle accelerators to produce "the world's brightest beams, enabling a new method of advanced X-ray lithography." The company claims its technology is comparable to ASML's high NA EUV, and notes it can extend well beyond 2nm. ASML has not publicly commented. The Nexperia chip sho... » read more

New Frontiers In Fault Detection And Classification
By Laura Peters - 14 Oct, 2025 - Comments: 0

IC manufacturers are increasingly relying on intelligent data processing to prevent downtime, improve yields, and reduce scrap. They are integrating that with fault detection and classification (FDC) to trace faults to their cause. Today’s FDC systems feature better sensors, variability control, and both predictive and prescriptive modeling. In the future, FDC will enable real-time decisio... » read more

Chip Industry Week in Review
By The SE Staff - 10 Oct, 2025 - Comments: 0

SEMICON West was held in Phoenix this week, with presentations covering heterogeneous integration, AI, quantum, supply chain resilience, and more. Amid the buzz of the conference, some key manufacturing and test announcements were made this week: The strategic importance of the Phoenix area hub was highlighted. Amkor Technology broke ground this week on its advanced packaging and test camp... » read more

Chip Industry Week in Review
By The SE Staff - 03 Oct, 2025 - Comments: 0

Samsung and SK hynix joined OpenAI's Stargate initiative to ensure there will be enough memory chips to meet the needs of AI data centers. The goal is to produce up to 900,000 DRAM wafer starts per month. OpenAI also inked agreements to explore the development of next-gen data centers in Korea. Axcelis Technologies (ion implantation systems) will merge with Veeco Instruments (compound semic... » read more

Chip Industry Week in Review
By The SE Staff - 12 Sep, 2025 - Comments: 0

The U.S. is considering annual approvals for Samsung and SK hynix to export chipmaking tools and materials to their factories in China, replacing perpetual waivers granted under the validated end user system, reports Bloomberg. The proposal, presented by the U.S. Commerce Department to South Korean officials, would require the companies to reapply each year for specific quantities of restricted... » read more

Making The Most of Test Resources
By Laura Peters - 09 Sep, 2025 - Comments: 0

Semiconductor testing is undergoing multiple paradigm changes at once with the common goals of producing more known good die per month with low test cost. Achieving these goals requires a delicate balance between yield, quality, and test times. There are multiple ways to go about making better use of existing resources, many of which involve an increasing use of design for test (DFT) methods... » read more

The Hidden Cost Of Contact Resistance
By Gregory Haley - 09 Sep, 2025 - Comments: 1

Contact resistance, or CRES, is one of those problems that most engineers prefer not to think about until it's staring them in the face. For years, it could be managed quietly with routine probe card cleaning or a scheduled socket swap. That approach worked well enough when pin counts were lower and devices pulled less current, but the ground has shifted since then. Today’s AI processors m... » read more

Infusing Trust Into The Supply Chain
By Anne Meixner - 09 Sep, 2025 - Comments: 0

An expanding supply chain of dies feeding multi-die products is prompting chipmakers to reassess and expand on ways to instill trust from end to end. This reaches deeper than just connecting disparate data. It requires integrating complex systems across vendors and protecting vendor data while instilling confidence in their customers and partners. Yet despite the time and effort that has bee... » read more

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