tag: Teradyne

Wafer Probe Struggles To Adapt To Multi-Die Assemblies
By Gregory Haley - 13 Jan, 2026 - Comments: 1

Wafer probe, one of the key processes for ensuring reliability in semiconductor manufacturing, is becoming increasingly unreliable in multi-die assemblies and at leading-edge nodes. For much of the semiconductor industry’s history, wafer probe occupied a stable, largely uncontested role in manufacturing. It was understood as a screening step, an electrical checkpoint to identify failing de... » read more

Secure Data Sharing Becoming Critical For Chip Manufacturing
By Laura Peters - 13 Jan, 2026 - Comments: 0

Semiconductor companies increasingly need to share data to solve problems faster, boost yield, and trace the root cause of failed devices. But to make that work, companies need assurances that their data will be secure, free from data leaks that could result in the loss of valuable IP. Data sharing is becoming critical at leading device nodes, where process variability is starting to consume... » read more

High-Throughput Image Sensors: Smart Testing Powers Progress
By Alexander Metzdorf - 13 Jan, 2026 - Comments: 0

In the race to produce higher resolution image sensors—now pushing beyond 500 megapixels—the industry faces significant challenges. These sensors aren’t just capturing more pixels; they’re handling massive streams of data, validating intricate on-chip AI functions, and doing it all at breakneck speeds. For manufacturers, the challenge is as unforgiving as it is critical: test more compl... » read more

Adaptive Test Gaining Ground For HPC And AI Chips
By Gregory Haley - 09 Dec, 2025 - Comments: 0

Adaptive test is starting to gain traction for high-performance computing and AI chips as test programs that rely on static limits and fixed test sequences reach their practical limits. The growing complexity of multi-die assemblies and power delivery, along with increased stresses, are forcing a shift toward real-time, data-driven optimization at the test cell. “It’s the same old pro... » read more

Invisible Interfaces: The Hidden Challenge Behind Every Great Image Sensor
By Alexander Metzdorf - 09 Dec, 2025 - Comments: 0

When you snap a photo on your phone or rely on a car’s camera for lane detection, you’re trusting an unseen network of technologies to deliver or interpret image data flawlessly. But behind the scenes, the interface between the image sensor and its processor is doing the heavy lifting, moving megabtyes of data without error or delay. While much of the industry conversation focuses on adv... » read more

Zero-Trust Data Sharing Architectures Redefining Chip Manufacturing
By Anne Meixner - 09 Dec, 2025 - Comments: 0

Real-time security clearances are becoming increasingly common in the manufacturing of advanced-node semiconductors, where data sharing is both essential and a potential security threat. Data security is a well-known issue in semiconductor manufacturing, but much of it is based on an outdated approach. In its place, zero-trust architectures [1] are now a requirement for new equipment and ins... » read more

AI In Test Analytics: Promise Vs. Reality
By Gregory Haley - 11 Nov, 2025 - Comments: 0

The semiconductor industry is increasingly turning to artificial intelligence as the solution for increasing complexity in test analytics, hoping algorithms can tame the growing flood of production data. The need to extract actionable insight from that torrent is pressing. AI/ML (AI) models promise to find correlations buried in multidimensional datasets, predict failures before they occur, and... » read more

New Rules Put The Squeeze On Semiconductor Gray Market
By Anne Meixner - 11 Nov, 2025 - Comments: 0

The shift toward chiplets and multi-die assemblies is forcing big changes in the global supply chain, including much tighter cooperation between companies and governments to ensure the authenticity and quality of semiconductor parts. The chip industry has been looking to digital certificates as the best means of reducing counterfeiting and ensuring consistent quality for some time. The probl... » read more

Solving Today’s Toughest Test Challenges: A New Era Of Engineering Productivity
By Ed Seng - 11 Nov, 2025 - Comments: 0

Today’s test engineers face unprecedented demands as semiconductor designs grow more complex and product cycles accelerate. Advanced packaging, chiplet architectures, and AI accelerators are reshaping the landscape, yet engineering resources remain fixed. Traditional approaches to scaling productivity by adding headcount no longer apply. While cost of test is always a consideration, ensuri... » read more

Chip Industry Week in Review
By The SE Staff - 07 Nov, 2025 - Comments: 0

SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more

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