tag: Teradyne

Blog Review: Jan. 24
By Jesse Allen - 24 Jan, 2024 - Comments: 0

Siemens' John McMillan finds that while 3D-IC capabilities are ready for mainstream, mass adoption success depends on how easily, effectively, and efficiently a solution can be delivered and points to five workflow adoption focus areas. Cadence's Andre Baguenie shows how to easily convert a logic signal to an electrical value using Verilog-AMS and the transition filter. Synopsys' Chris Cl... » read more

Glass Substrates Gain Foothold In Advanced Packages
By Gregory Haley - 09 Jan, 2024 - Comments: 2

Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still plenty of problems to solve before this approach becomes mainstream. While glass itself is cheap and shares some important physical similarities to silicon, there are challenges with buildup, stre... » read more

Plugging Gaps In The IC Supply Chain
By Anne Meixner - 09 Jan, 2024 - Comments: 0

Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and reliability, and opening the door to counterfeit or sub-standard parts. This involves more than just assigning a simple identifying code to a chip. At different points in a device's lifecycle, new... » read more

Testing ICs Faster, Sooner, And Better
By Laura Peters - 12 Dec, 2023 - Comments: 0

The infrastructure around semiconductor testing is changing as companies build systems capable of managing big data, utilizing real-time data streams and analysis to reduce escape rates on complex IC devices. At the heart of these tooling and operational changes is the need to solve infant mortality issues faster, and to catch latent failures before they become reliability problems in the fi... » read more

Closing The Test And Metrology Gap In 3D-IC Packages
By Gregory Haley - 12 Dec, 2023 - Comments: 0

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and wearable tech most likely will be powered by multiple layers of intricately connected silicon, a stark departure from the planar landscapes of traditional integrated circuits. These 3D-ICs, compos... » read more

Fingerprinting Chips For Traceability
By Anne Meixner - 12 Dec, 2023 - Comments: 0

Semiconductor components increasingly require unclonable and tamper resistant identifiers, which are especially necessary as devices become increasingly heterogeneous collections of chiplets and subsystems. These fingerprints provide traceability, which contributes to process improvements and yield learning and enable tracking for a tightly managed supply chain. While some of this technology... » read more

Chip Industry Week In Review
By The SE Staff - 01 Dec, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

Applying ML In Failure Analysis
By Anne Meixner - 20 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran H... » read more

Chip Industry Week In Review
By The SE Staff - 10 Nov, 2023 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Bosch, Infineon, and NXP were cleared in Germany to each acquire 10% of the European Semiconductor Manufacturing Co. (ESMC), established by TSMC, solidifying the supply chain against future shortages, particularly for automotive chips. “ESMC intends to build and operate another large semiconductor factory in Dresden, in which the three Europ... » read more

DRAM Test And Inspection Just Gets Tougher
By Anne Meixner - 07 Nov, 2023 - Comments: 0

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming much more difficult with the rollout of faster interfaces and multi-chip packages. DRAM plays a key role in a wide variety of electronic devices, from phones and PCs to ECUs in cars and servers ins... » read more

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