tag: Teradyne

Integration Challenges For ATE Data
By Gregory Haley - 10 Oct, 2023 - Comments: 0

Tighter integration of automatic test equipment (ATE) into semiconductor manufacturing, so that data from one process can be seamlessly leveraged by another, holds significant promise to boost manufacturing efficiency and yield. The challenge is selling this concept to fabs, packaging houses, and their customers. Data involving yield parameters, process variations, and intricate details abou... » read more

Streamlining Failure Analysis Of Chips
By Anne Meixner - 10 Oct, 2023 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran Hak... » read more

Delivering Real-Time Analytics To Semiconductor Test
By Eli Roth - 10 Oct, 2023 - Comments: 0

As defined by Moore’s Law, the semiconductor field has been growing at a steady pace since the 1960s. Concurrent with this progression, semiconductors are becoming more complex, densely integrated, and expensive to produce. While such advancements pose new challenges to semiconductor manufacturing, we can extend Moore’s Law well into the future by reimagining the way we approach the semicon... » read more

Fab And Field Data Transforming Manufacturing Processes
By Gregory Haley - 12 Sep, 2023 - Comments: 0

The ability to capture, process, and analyze data in the field is transforming semiconductor metrology and testing, providing invaluable insight into a product's performance in real-time and under real-world conditions and use cases. Historically, data that encapsulates parameters such as power consumption, temperature, voltages, currents, timing, and other characteristics, was confined to d... » read more

Customizing IC Test To Improve Yield And Reliability
By Ed Sperling - 12 Sep, 2023 - Comments: 0

Testing the performance and power of semiconductors as they come off the production line is beginning to shift left in the fab, reversing a long-standing trend of assessing chips just prior to shipping. While this may sound straightforward, it's a difficult challenge which, if successful, will have broad implications for the entire design-through-manufacturing flow. Manufacturers typically g... » read more

Test Strategies In The Era Of Heterogeneous Integration
By Fisher Zhang - 12 Sep, 2023 - Comments: 0

Moore’s Law, the observation that the number of transistors on an integrated circuit doubles approximately every two years, is critical to advances in computing technology. For decades, fabs have managed to achieve exponential growth in digital capability and transistor density by making transistors smaller and smaller, but we’ve hit the physical limits of these processes. Today, new proces... » read more

Blog Review: Aug. 9
By Jesse Allen - 09 Aug, 2023 - Comments: 0

Synopsys' John Swanson and Manmeet Walia note that designing for 224G Ethernet will entail some unique considerations, as design margins will be extremely tight, making it mission-critical to optimize individual analog blocks to reduce impairments. Cadence's Rick Sanborn finds that knowing how best to debug common partitioning-related issues and implicitly control them using common features ... » read more

SiC Growth For EVs Is Stressing Manufacturing
By Anne Meixner - 08 Aug, 2023 - Comments: 0

The electrification of vehicles is fueling demand for silicon carbide power ICs, but it also is creating challenges in finding and identifying defects in those chips. Coinciding with this is a growing awareness about just how immature SiC technology is and how much work still needs to be done — and how quickly that has to happen. Automakers are pushing heavily into electric vehicles, and t... » read more

Sustainable Products For A More Sustainable World
By Mike Halblander - 08 Aug, 2023 - Comments: 0

Teradyne’s sustainability journey began three decades ago with a focus on minimizing the environmental impact of our buildings and infrastructure, as outlined in our two part blog series (check out part one and part two). This effort also includes a focus on making our products more sustainable. In this blog, learn how Teradyne’s products and efforts are contributing to a more sustainabl... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

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