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Chip Industry’s Technical Paper Roundup: Nov. 21


New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

Profile-Guided HW/SW Mechanism To Efficiently Reduce Branch Mispredictions In Data Center Applications (Best Paper Award)


A new technical paper titled "Whisper: Profile-Guided Branch Misprediction Elimination for Data Center Applications" was published by researchers at University of Michigan, ARM, University of California, Santa Cruz, and Texas A&M University. This work was awarded a best paper award at October's 2022 Institute of Electrical and Electronics Engineers (IEEE)/Association for Computing Machin... » read more

Security Research: Technical Paper Round-Up


A number of hardware security-related technical papers were presented at recent conferences, including the August 2022 USENIX Security Symposium and IEEE’s International Symposium on Hardware Oriented Security and Trust (HOST). Topics include side-channel attacks and defenses (including on-chip mesh interconnect attacks), heterogeneous attacks on cache hierarchies, rowhammer attacks and mitig... » read more

Defending Against Message Injection Attacks in Vehicles


This technical paper titled "SAID: State-aware Defense Against Injection Attacks on In-vehicle Network" was presented by researchers at the Hong Kong Polytechnic University, Zhejiang University, and Texas A&M University at the USENIX Security Symposium in Boston in August 2022. Abstract: "Modern vehicles are equipped with many ECUs (Electronic Control Unit) that are connected to the IVN (... » read more

Efficacy of Transistor Interleaving in DICE Flip-Flops at a 22 nm FD SOI Technology Node


New research paper from University of Saskatchewan, with funding by NSERC and the Cisco University Research Program. Abstract "Fully Depleted Silicon on Insulator (FD SOI) technology nodes provide better resistance to single event upsets than comparable bulk technologies, but upsets are still likely to occur at nano-scale feature sizes, and additional hardening techniques should be explor... » read more

Research Bits: April 19


Processor power prediction Researchers from Duke University, Arm Research, and Texas A&M University developed an AI method for predicting the power consumption of a processor, returning results more than a trillion times per second while consuming very little power itself. “This is an intensively studied problem that has traditionally relied on extra circuitry to address,” said Zhiy... » read more

Power/Performance Bits: Nov. 8


Molecular memristor Researchers from National University of Singapore, Indian Association for the Cultivation of Science, University of Limerick, Texas A&M University, and Hewlett Packard Enterprise discovered a molecular memristor for brain-inspired computing. The molecule uses natural asymmetry in its metal-organic bonds to switch between different states, which allows it to perform u... » read more

Manufacturing Bits: Sept. 28


Self-healing ceramics Texas A&M University has discovered a new self-healing mechanism for ceramics, a technology that could one day be used for jet engines, hypersonic aircraft and nuclear reactors. Ceramics involve various materials that are neither metallic nor organic, but rather they are crystalline and/or glassy, according to the University of Maryland. One common example is clay,... » read more

Power/Performance Bits: July 13


Graphene PUFs Researchers at Pennsylvania State University propose using graphene to create physically unclonable functions (PUFs) that are energy efficient, scalable, and secure against AI attacks. The team first fabricated nearly 2,000 identical graphene transistors. Despite their structural similarity, the transistors' electrical conductivity varied due to the inherent randomness arising... » read more

Power/Performance Bits: Nov. 3


Wirelessly charging multiple devices Researchers from ITMO University developed a metamaterial that can be used to turn surfaces into wireless charging areas for multiple devices from different manufacturers with different power transfer standards. "There are various wireless power transfer standards with different frequencies, so you can't just use a charger by any manufacturer," said Poli... » read more

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