Chip Industry Technical Paper Roundup: Nov. 11


New technical papers recently added to Semiconductor Engineering’s library: [table id=381 /] More Reading Technical Paper Library » read more

Effectiveness of Hardware Fuzzing In Detecting Memory Vulnerabilities


A new technical paper titled "Fuzzerfly Effect: Hardware Fuzzing for Memory Safety" was published by researchers at Technical University of Darmstadt, Texas A&M University and Delft University of Technology. Abstract: "Hardware-level memory vulnerabilities severely threaten computing systems. However, hardware patching is inefficient or difficult post-fabrication. We investigate the eff... » read more

Chip Industry Week In Review


Analog Devices acquired Flex Logix's technology assets, along with its technical team. Semiconductor global sales increased 23% in Q3 2024 $166B, up almost 11% versus the same period in 2023, according to SIA. Notable regional year-to-year sales in September: Americas up 46%, China up 23%, Europe down 8%. Fig.1: Worldwide Semiconductor Revenues, year-to-year % change. Source: Semiconduc... » read more

Chip Industry Technical Paper Roundup: Nov. 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=378 /]   Further Reading Chip Industry Week In Review Silicon Valley design center and NY EUV Accelerator; Siemens’ big acquisition; Onto extends panel inspection with two acquisitions; DENSO-Quadric deal; thinner Si-based power wafer; $100M funding for AI; trade wars escalate; earnings rep... » read more

Pre-Silicon Verification Method Addressing Critical Aspects of Speculative Execution Vulnerability Detection


A new technical paper titled "Lost and Found in Speculation: Hybrid Speculative Vulnerability Detection" was published by researchers at Technical University of Darmstadt and Texas A&M University. "We introduce Specure, a novel pre-silicon verification method composing hardware fuzzing with Information Flow Tracking (IFT) to address speculative execution leakages. Integrating IFT enables two... » read more

LLMs Show Promise In Secure IC Design


The introduction of large language models into the EDA flow could significantly reduce the time, effort, and cost of designing secure chips and systems, but they also could open the door to more sophisticated attacks. It's still early days for the use of LLMs in chip and system design. The technology is just beginning to be implemented, and there are numerous technical challenges that must b... » read more

Chip Industry Technical Paper Roundup: April 30


These new technical papers were recently added to Semiconductor Engineering’s library. [table id=222 /] Find more technical papers here. » read more

Chip Industry Technical Paper Roundup: April 23


New technical papers recently added to Semiconductor Engineering’s library. [table id=216 /] Find last week’s technical paper additions here. » read more

Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Memristor Crossbar Architecture for Encryption, Decryption and More


A new technical paper titled "Tunable stochastic memristors for energy-efficient encryption and computing" was published by researchers at Seoul National University, Sandia National Laboratories, Texas A&M University and Applied Materials. Abstract "Information security and computing, two critical technological challenges for post-digital computation, pose opposing requirement... » read more

← Older posts