tag: Texas Instruments

EUV Focus Shifts To Affordability
By Ed Sperling - 08 Jul, 2010 - Comments: 0

By David Lammers Over the past year, key technologists in the semiconductor industry have come around to believing that EUV lithography will be available for critical mask layers in the next three to five years. What is still up for debate is whether EUV will be cost-effective for low-power consumer SoCs. To penetrate that cost-sensitive market, EUV must overcoming hurdles presented by masks, ... » read more

Make vs. Buy
By Ann Mutschler - 25 Feb, 2010 - Comments: 0

By Ann Steffora Mutschler The age-old question of whether to make or buy is time immemorial, and is particularly true for the cyclical semiconductor industry. At the end of the day, the answer comes down to how the decision maker feels about having or losing control. Fifteen years ago, whether to make or buy something—be it the design, libraries, memory, implementation, verification, te... » read more

Smart-Grid Designs Solve Low-Power Riddles
By Various Writers - 11 Feb, 2010 - Comments: 0

By Ellen Konieczny Imagine that you go to your kitchen to get a drink and pass your home’s energy-usage monitor. Due to a recent heat wave, you see that your energy usage is already at what it usually is for the entire month. Yet you’ve still got one week left in your billing cycle. To keep the bill low, you turn your A/C thermostat up a degree and make a mental note to not keep lights o... » read more

Stacked Dies Gain Attention, But So Far Little Traction
By Ed Sperling - 17 Dec, 2009 - Comments: 0

By Ed Sperling For the better part of two decades there has been a steady stream of predictions about the abrupt end of Moore’s Law, but it now appears the formula for doubling the number of transistors on a die every couple years will simply dissipate rather than fall off a cliff. While companies such as Intel and IBM continue to develop road maps that extend their road maps all the wa... » read more

The Ins And Outs Of Power Conversion
By Ed Sperling - 10 Dec, 2009 - Comments: 0

By Cheryl Ajluni Power conversion is a general term that refers to a system or device producing an output that is different than its input. It can assume many forms—everything from an inverter to an isolated power supply, uninterruptable power supply (UPS), or AC/DC converter. Power conversion, like low-power design, is fairly commonplace these days. Nevertheless, recent advances in digital ... » read more

More Choices But Less Design Freedom
By Ed Sperling - 19 Nov, 2009 - Comments: 0

By Ed Sperling “What if” is an indelible part of the lexicon of every SoC architect and design engineer from the front end of the design flow all the way to manufacturing, but while the terminology will persist for years to come the answers and the value of those answers are starting to change. Complexity, cost and the need for better integration have simultaneously increased the numb... » read more

Outsourcing’s New Face
By Ed Sperling - 29 Oct, 2009 - Comments: 0

By Ed Sperling As the semiconductor industry digs out from one of the worst downturns in decades, the business of semiconductor design and engineering is changing. While the architecture and features are still being developed by chip companies, the actual work of developing the chip increasingly is being done by third parties. Outsourcing is hardly new concept in business. In the early pa... » read more

Pulling Power Out Of Thin Air
By Ed Sperling - 17 Sep, 2009 - Comments: 0

By Cheryl Ajluni It wasn’t all that long ago that voice communication via a traditional landline was the norm. At the time, consumers would have been hard pressed to imagine a world in which anytime, anywhere communication (voice and data) with a device no bigger than the human hand was possible. Many of those same consumers might today find it hard to conceive of a world in which their... » read more

Experts At The Table: Evolving Standards
By Ed Sperling - 27 Aug, 2009 - Comments: 0

System-Level Design sat down with Keith Barkley, senior engineer in IBM’s systems and technology group; Steven Schulz, president and CEO of Silicon Integration Initiative (Si2); Yatin Trivedi, director of standards and interoperability programs at Synopsys; Ian Mackintosh, chairman of the OCP International Partnership (OCPIP), and Michael Meredith, vice president of technical marketing at For... » read more

Software Becomes The Main Differentiating Factor
By Ed Sperling - 10 Jun, 2009 - Comments: 0

By Ed Sperling Software has always been critical in determining what makes one chip different from another, but for the next couple of process nodes it will take on new significance. Rather than just defining function, it also will be one of the key determinants in performance and function. Behind this change is a bottleneck in lithography, which generally is not something most design eng... » read more

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