Thermal Characterization For Power Semiconductor Packages (KATECH)


Researchers from Korea Automotive Technology Institute published "Analytical Extraction of Thermal Resistance in Power Semiconductors Using Structural Function Derivatives and Series Resistance Modeling." Abstract "Junction-to-case thermal resistance (RthJC ) is a critical parameter for assessing the reliability and thermal performance of power semiconductor devices. Conventional JEDEC-ba... » read more

Analysis of Thermal and Mechanical Behavior for Advanced Packaging (Sungkyunkwan Univ. et al)


A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations” was published by researchers at Sungkyunkwan University, Korea Institute of Industrial Technology, Korea University, Seoul National University, and Pukyong National University. Abstract Excerpt “... » read more

Hot Or Not? An Introduction To Electrical Thermal Co-Design


Heat transfer is not a one-way street. Traditionally, thermal analysis and management is thought of as a mechanical problem. However, modern electronic products are highly susceptible to electronic thermal issues. The electronics are often both the cause of thermal issues and the victim of overheating if temperature profiles exceed specifications. Indeed, over 50% of IC failures are related ... » read more

Investigation Of The Influence of Controller Types On Room Thermal Behavior – A Simulation Study


To control the indoor temperature of rooms two kinds of approaches are common. The first one is to use standard PI-controllers with a set of default parameters, which often leads to insufficient performance, waste of energy and unacceptable comfort violations [Rahmati, 2003]. The other approach is to use specifically developed and adapted controllers [Seidel et al., 2015], which have the drawba... » read more