Hot Or Not? An Introduction To Electrical Thermal Co-Design

Why thermal analysis needs to be performed and what are the nuances, pitfalls, and challenges of thermal design.


Heat transfer is not a one-way street.

Traditionally, thermal analysis and management is thought of as a mechanical problem. However, modern electronic products are highly susceptible to electronic thermal issues. The electronics are often both the cause of thermal issues and the victim of overheating if temperature profiles exceed specifications. Indeed, over 50% of IC failures are related to thermal issues. Many current methods for analyzing thermal effects however, are often unable to accurately predict the electronic feedback of the device current, leaving an incomplete model of thermal performance. Over-simplified models, missed issues, and over-designed margins are all results of incomplete data capture, and design issues such as hotspots and current clustering are likely to be missed. As such, the more accurate the electrical thermal model, the more reliable the product is both from an electrical and mechanical standpoint.

It’s important to realize thermal issues are an electrical problem that needs to be addressed. This e-book will discuss why thermal analysis needs to be performed in the electrical domain and highlight several nuances, pitfalls, and challenges of thermal design and how to best navigate them.

Click here to read e-book.

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