tag: thin films

Power/Performance Bits: Aug. 7
By Jesse Allen - 07 Aug, 2018 - Comments: 0

Optical neural network Researchers at the National Institute of Standards and Technology (NIST) have made a silicon chip that distributes optical signals precisely across a miniature brain-like grid, showcasing a potential new design for neural networks. Using light would eliminate interference due to electrical charge and the signals would travel faster and farther, said the researchers. "... » read more

Power/Performance Bits: April 24
By Jesse Allen - 24 Apr, 2018 - Comments: 0

Waste heat to power Engineers at the University of California, Berkeley, developed a thin-film system that can be applied to electronics to turn waste heat into energy. The thin-film system uses pyroelectric energy conversion, which is well suited for tapping into waste-heat energy supplies below 100 degrees Celsius, called low-quality waste heat. In particular, the technology might be part... » read more

Power/Performance Bits: Jan. 30
By Jesse Allen - 30 Jan, 2018 - Comments: 0

Wavy display architecture Researchers at KAUST developed a new transistor architecture for flexible ultrahigh resolution devices aimed at boosting the performance of the display circuitry. Flat-panel displays use thin-film transistors, acting as switches, to control the electric current that activates individual pixels consisting of LEDs or liquid crystals. A higher field-effect mobility of... » read more

The Next 5 Years Of Chip Technology
By Ed Sperling - 18 Dec, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies, with Rick Gottscho, CTO of [getentity id="22820" comment="Lam Research"]; Mark Dougherty, vice president of advanced module engineering at [getentity id="22819" comment="GlobalFoundries"]; David Shortt, technical fellow at [getentity id="22876" co... » read more

Power/Performance Bits: Nov. 21
By Jesse Allen - 21 Nov, 2017 - Comments: 0

Greener greenhouses Researchers at the University of California, Santa Cruz are testing greenhouses capable of generating some of their own energy, without hampering plant growth. Greenhouses use electricity to control temperature and power fans, lights, and other monitoring systems. Electricity-generating solar greenhouses utilize Wavelength-Selective Photovoltaic Systems (WSPVs), a novel ... » read more

Integrated Passives Market Gets Active
By Jeff Dorsch - 09 Oct, 2017 - Comments: 0

Integrated passive devices are seeing greater use within system-in-package technology and numerous applications, including the Internet of Things. The tiny devices are making their way into automotive electronics, consumer electronics, and health-care products, among other uses. Europe is leading the way in supplying IPDs, thanks to offerings from Infineon Technologies, STMicroelectronics, a... » read more

Intel Inside The Package
By Ed Sperling - 08 May, 2017 - Comments: 1

Mark Bohr, senior fellow and director of process architecture and integration at Intel, sat down with Semiconductor Engineering to discuss the growing importance of multi-chip integration in a package, the growing emphasis on heterogeneity, and what to expect at 7nm and 5nm. What follows are excerpts of that interview. SE: There’s a move toward more heterogeneity in designs. Intel clearly ... » read more

Good Filters, Poor Resists
By Katherine Derbyshire - 14 Sep, 2016 - Comments: 0

Shrinking feature sizes and more complex lithography schemes are increasing the pressure on all aspects of the lithography process, including resists and resist filtration. As Clint Haris, vice president and general manager for liquid micro contamination control at Entegris explained, fabs are pushing resist manufacturers toward more stringent control of both contaminants and “soft particl... » read more

The Trouble With MEMS
By Ed Sperling - 25 May, 2016 - Comments: 0

The advent of the Internet of Things will open up a slew of new opportunities for MEMS-based sensors, but chipmakers are proceeding cautiously. There are a number of reasons for that restraint. Microelectromechanical systems are difficult to design, manufacture and test, which initially fueled optimism in the MEMS ecosystem that this market would command the same kinds of premiums that analo... » read more

How To Make 3D NAND
By Mark LaPedus - 23 May, 2016 - Comments: 0

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

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