Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan. Europe's semiconductor footprint is growing in areas that previously had little association with chips. Silicon Box plans to build a panel-level foundry in northern Italy, funded in part by the Italian government. The deal is worth around €3.2 billion ($3.6B). In addition, imec will establish a specialized 300mm chip technology pilot line in M... » read more

Suppressing Power Side-Channel Attacks: A HW/SW Design For Resource-Constrained IoT Devices


A technical paper titled “Hardware/Software Cooperative Design Against Power Side-Channel Attacks on IoT Devices” was published by researchers at Tokyo Institute of Technology and the University of Electro-Communications. Abstract: "With the growth of Internet of Things (IoT) era, the protection of secret information on IoT devices is becoming increasingly important. For IoT devices, atta... » read more

Chip Industry Talent Shortage Drives Academic Partnerships


Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Research Bits: August 29


Resistive switching with hafnium oxide Researchers from the University of Cambridge, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo used hafnium oxide to build a resistive switching memory device that processes data in a similar way as the synapses in the human brain. At the atomic level, hafnium oxide has no structure, with the hafni... » read more

Chip Industry’s Technical Paper Roundup: June 20


New technical papers added to Semiconductor Engineering’s library this week. [table id=112 /] » read more

Metallic Behaviour of Semiconducting Colloidal Quantum Dots (RIKEN, Others)


A technical paper titled “Enabling metallic behaviour in two-dimensional superlattice of semiconductor colloidal quantum dots” was published by researchers at RIKEN Center for Emergent Matter Science (CEMS), Tokyo Institute of Technology, RIKEN SPring-8 Center, The University of Tokyo, and Tokyo University of Agriculture and Technology. Abstract "Semiconducting colloidal quantum dots ... » read more

Research Bits: Feb. 6


Pillars for chiplet integration Researchers from the Tokyo Institute of Technology proposed a new chiplet integration technology called Pillar-Suspended Bridge (PSB), which they say is a simpler method of chip-to-chip connection compared to silicon interposers and redistribution layers. In the PSB, only a pillar-shaped metal structure called a "MicroPillar" is interposed at the connection b... » read more

Research Bits: Nov. 7


ADC side-channel attacks Researchers at MIT propose two ways to protect analog-to-digital converters (ADCs) from power and electromagnetic side-channel attacks. The researchers first investigated the side-channel attacks that could be used against ADCs. Power attacks usually involve an attacker soldering a resistor onto the device’s circuit board to measure its power usage. An electromagn... » read more

Week In Review: Semiconductor Manufacturing, Test


This week saw more fallout from U.S. export controls: SK hynix may consider selling its memory chip production facilities in China if recently imposed controls make it too difficult to continue operations there, according to Nikkei Asia. "As a contingency plan, we are considering selling the fab, selling the equipment or transferring the equipment to South Korea," said Kevin Noh, SK hynix ... » read more

Research Bits: Oct. 25


Polarization for photonic processor Researchers from the University of Oxford and University of Exeter developed a photonic processor that uses multiple polarization channels, increasing information density. "We all know that the advantage of photonics over electronics is that light is faster and more functional over large bandwidths. So, our aim was to fully harness such advantages of phot... » read more

← Older posts Newer posts →