tag: Toshiba

Following The Yen
By Dan Tracy - 17 Oct, 2013 - Comments: 0

An examination of the installed fab capacity base in Japan shows that total capacity expansion has stalled in recent years due to the consolidation and closures of facilities. The closure and consolidation of 27 facilities between 2009 and 2012 reduced the installed fab capacity in Japan by at least 350,000 200mm equivalent wafers per month. With that said, investments continued in some industr... » read more

MRAM Begins To Attract Attention
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus In the 1980s, there were two separate innovations that changed the landscape in a pair of related fields—nonvolatile memory and storage. In one effort, Toshiba invented the flash memory, thereby leading to NAND and NOR devices. On another front, physicists discovered the giant magnetoresistance (GMR) effect, a technology that forms the basis of hard disk drives, magnetores... » read more

Japan: Latest Investment Activities
By Dan Tracy - 15 Aug, 2013 - Comments: 0

By Dan Tracy and Yoichiro Ando Restructuring and consolidation has led to a new focus for the semiconductor manufacturers in Japan. As a result, the semiconductor equipment market in Japan will experience double-digit growth in both 2013 and 2014, driven by higher spending for memory production and in spending increases planned for the manufacturing of power semiconductors and “More than Moo... » read more

Mixed Signals
By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Based on the various forecasts for semiconductor equipment, the mood is mixed at this week’s Semicon West trade show in San Francisco. In its mid-year forecast, for example, SEMI predicts that the semiconductor equipment market will reach $36.3 billion in 2013, down 1.7% over 2012. But the business is expected to rebound and reach $43.98 billion in 2014, a 21.2 percent inc... » read more

The Week In Review: July 8
By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Fab tool vendors this week will gather at the annual Semicon West trade show in San Francisco. The mood is expected to be both gloomy and upbeat, at least based on one new and mixed forecast. The semiconductor equipment market is projected to fall 7.4% in 2013, but it will grow 27.1% in 2014, according to VLSI Research. The forecast for semis is up 10% in 2013 and 8.3% growth i... » read more

3D NAND Market Heats Up
By Mark LaPedus - 16 May, 2013 - Comments: 0

By Mark LaPedus It’s the tale of two promising and separate 3D chip architectures. One technology is slowly taking root, while the other one is heating up. 3D stacked-die using through-silicon vias (TSVs) is on the slower path. Advanced chip-stacking has several challenges and is still a few years away from mass production. In contrast, 3D NAND is heating up, as Samsung and SK Hynix are a... » read more

Making An Impression with Nanoimprint
By Mark LaPedus - 21 Mar, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss the trends in lithography with Mark Melliar-Smith, president and chief executive of Molecular Imprints Inc. (MII), a supplier of nanoimprint lithography tools. SMD: How do you view the IC industry now? Melliar-Smith: It’s truly incredible work that this industry continues to do. The industry will see its way f... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE
;1-4 OCT, NAPA
By Various Writers - 25 Sep, 2012 - Comments: 0

The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

NAND Enters Tough Cycle
By Ed Sperling - 20 Sep, 2012 - Comments: 0

By Mark LaPedus The NAND flash memory market is entering into a new and painful cycle, a period that will impact suppliers, OEMs and fab tool vendors alike. For some time, there has been an oversupply and depressed pricing in the NAND market. In mid-2011, Micron, Samsung, SK Hynix and Toshiba put on the brakes in their capital spending plans. And in recent months, NAND suppliers in total h... » read more

Universal Memories Fall Back To Earth
By Ed Sperling - 20 Sep, 2012 - Comments: 0

By Mark LaPedus Ten years ago, Intel Corp. declared that flash memory would stop scaling at 65nm, prompting the need for a new replacement technology. Thinking the end was near for flash, a number of companies began to develop various next-generation memory types, such as 3D chips, FeRAM, MRAM, phase-change memory (PCM), and ReRAM. Many of these technologies were originally billed as “uni... » read more

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