Radar Transceivers: How To Connect The Antennas

By Marta Martinez Vazquez - 07 Sep, 2023 - Comments: 0

There are different antenna options for transmitting and receiving a radar signal. This blog will focus on how to connect a monolithic microwave integrated circuit (MMIC) radar transceiver to the antennas in a way that guarantees an efficient transfer of the signals. mmWave MMIC to antenna interfaces At millimeter-wave (mmWave) frequencies, any transitions between two different transmission l... » read more

How The Doubling Of Interconnect Bandwidth With PCI Express 6.0 Impacts IP Electrical Validation

By Synopsys - 07 Mar, 2023 - Comments: 0

As a result of the innovations taking place in CPUs, GPUs, accelerators, and switches, the interface in hyperscale datacenters now requires faster data transfers both between compute and memory and onto the network. PCI Express (PCIe®) provides the backbone for these interconnects and is used to build protocols such as Computer Express Link (CXL™) and Universal Chiplet Interconnec... » read more

A RISC-V ISA Extension For Ultra-Low Power IoT Wireless Signal Processing

By Codasip - 24 Mar, 2021 - Comments: 0

This work presents an instruction-set extension to the open-source RISC-V ISA (RV32IM) dedicated to ultra-low power (ULP) software-defined wireless IoT transceivers. The custom instructions are tailored to the needs of 8/16/32-bit integer complex arithmetic typically required by quadrature modulations. The proposed extension occupies only 2 major opcodes and most instructions are designed to co... » read more

Power/Performance Bits: March 23

By Jesse Allen - 23 Mar, 2021 - Comments: 0

Metasurface for optical media Researchers at Purdue University proposed a new way to store information in optical media, such as CDs and DVDs, that could improve both storage capacity and read times. The development focuses on encoding information in the angular position of tiny antennas, allowing them to store more data per unit area. "The storage capacity greatly increases because it is o... » read more

Analysis, Modeling And Characterization Of Multi-Protocol High-Speed Serial Links

By Rambus - 04 Dec, 2019 - Comments: 0

Improved analysis, modeling, characterization and correlation methods of multi-protocol high-speed transceivers that utilize T-coil to enhance the transmitter and receiver bandwidth, transmitter FIR filters and receiver CTLE and DFE equalizers is presented. The key circuit blocks are measured and modeled using IBIS-AMI models and the overall system performance including the eye diagrams, BER cu... » read more

Case Study—RF ASIC Validation Of A Satellite Transceiver

By Adesto Technologies - 12 Jun, 2019 - Comments: 0

ASIC validation in the RF world comes with its own set of hurdles and challenges, with high-quality lab equipment, experience and know-how essential. A recently completed RF sub-system validation at S3 Semiconductors is presented in the form of a case study of the execution. The validation PCB design focussed on impedance matching and shielding RF signals from noise sources. We built up an effi... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 25 Jan, 2019 - Comments: 0

Internet of Things Tony Franklin, Intel’s general manager for Internet of Things Segments, is interviewed by Lorin Fries on how the chipmaker is helping to develop smart farming applications. “We focus primarily on high-performance computer technologies, as well as communication technologies, which have great applicability for food systems. We work closely with a broad ecosystem of partner... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer