Power/Performance Bits: July 18

By Jesse Allen - 18 Jul, 2017 - Comments: 0

Ad hoc "cache hierarchies" Researchers at MIT and Carnegie Mellon University designed a system that reallocates cache access on the fly, to create new "cache hierarchies" tailored to the needs of particular programs. Dubbed Jenga, the system distinguishes between the physical locations of the separate memory banks that make up the shared cache. For each core, Jenga knows how long it would t... » read more

Power/Performance Bits: June 13

By Jesse Allen - 13 Jun, 2017 - Comments: 0

Theoretical all-carbon circuits Engineers at the University of Texas at Dallas, the University of Illinois at Urbana-Champaign, the University of Central Florida, and Northwestern University designed a novel computing system made solely from carbon. "The concept brings together an assortment of existing nanoscale technologies and combines them in a new way," said Dr. Joseph S. Friedman, ass... » read more

Why Investments At Advanced Nodes Matter

By Ed Sperling - 18 Sep, 2014 - Comments: 0

Despite all the talk about rising costs of development, uncertainties about lithography and talk about the death of Moore’s Law, a record number of companies are developing chips at 16nm/14nm. That may sound surprising, but asking why that’s happening is probably the wrong question. The really critical question is what they’re going to do with those chips. What’s become quite evident... » read more

What’s After 10nm?

By Mark LaPedus - 14 Nov, 2013 - Comments: 0

For some time, chipmakers have roughly doubled the transistor count at each node, while simultaneously cutting the cost by around 29%. IC scaling, in turn, enables faster and lower cost chips, which ultimately translates into cheaper electronic products with more functions. Consumers have grown accustomed to the benefits of Moore’s Law, but the question is for how much longer? Chips based ... » read more

FinFETs On SOI

By Ed Sperling - 13 May, 2013 - Comments: 0

Soitec's Steve Longoria talks with Semiconductor Manufacturing and Design about what's changing at the leading edge of Moore's Law and why those changes are necessary. [youtube vid=K6D39QqJWSU] » read more

Experts At The Table: Does 20nm Break System-Level Design?

By Ed Sperling - 28 Jun, 2012 - Comments: 1

By Ann Steffora Mutschler System-Level Design sat down to discuss design at 20nm with Drew Wingard, chief technology officer at Sonics; Kelvin Low, deputy director of product marketing at GlobalFoundries, Frank Schirrmeister, group director of product marketing for system development in the system and software realization group at Cadence; and Mike Gianfagna, vice president of marketing at Atr... » read more

The New Mobility Era

By Kathryn Ta - 26 Jun, 2012 - Comments: 0

By Kathryn Ta Transistors are the fundamental building blocks out of which all modern electronic devices are built. Invented in the early 1950s, transistors are the semiconductor switches that control and amplify electronic signals. As demand has grown over the years for greater performance from these devices, chipmakers have responded by packing wafers with twice as many of the transistors th... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: transistors