What’s changing at the leading edge of Moore’s Law and why those changes are so important.
Soitec’s Steve Longoria talks with Semiconductor Manufacturing and Design about what’s changing at the leading edge of Moore’s Law and why those changes are necessary.
Experts at the Table, part 1: Shrinking features isn’t enough anymore. The big challenge now is how to achieve economies of scale and minimize complex integration issues.
Rising costs and gaps in equipment emerge as technology scales; new tools under development.
Explosion of data is forcing significant changes in where processing is done.
EUV is the clear winner down to 5nm, but what comes after that may be a combination of tools and techniques.
New market opportunities and global competitiveness are limited by qualified people.
Researchers digging into ways around the von Neumann bottleneck.
The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen.
Better algorithms and more data could bolster adoption, particularly at advanced nodes.
30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.
New architectures, packaging approaches gain ground as costs increase, but shrinking features continues to play a role.
Improvement still needed for uptime, defectivity, line edge roughness and process flows.
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Leave a Reply