tag: chips

Real-Time Safety Monitoring
By Ed Sperling - 28 Aug, 2024 - Comments: 0

Various types of semiconductor test will determine whether a chip is free of defects and meets the specification, but understanding how it's behaving in the field under real workloads and harsh ambient conditions may be very different in automotive applications, where vibration, heat, cold can disrupt the normal functioning of a chip over time and reduce its lifespan. Alex Burlak, vice presiden... » read more

Heat-Related Issues Impact Reliability In Advanced IC Designs
By Ann Mutschler - 18 Jul, 2024 - Comments: 1

Heat is becoming a much bigger problem in advanced-node chips and packages, causing critical electrons to leak out of DRAM, timing and reliability issues in 3D-ICs, and accelerated aging that are unique to different workloads. All types of circuitry are vulnerable to thermal effects. It can slow the movement of the electrons through wires, cause electromigration that shortens the lifespan of... » read more

Navigating Heat In Advanced Packaging
By Gregory Haley - 18 Jan, 2024 - Comments: 0

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Advanced packaging provides a way to pack more features and functions into a device, increasingly by stacking various components vertically rather than ... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Design Issues For Chips Over Longer Lifetimes
By Ed Sperling - 08 Mar, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss the myriad challenges associated with chips used in complex systems over longer periods of time them with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Frank Schirrmeister, senior group director for solution marketing at Cadence; Maurizio Griva, R&D Manager at Reply; and Laurent Maillet-Contoz, system and architec... » read more

Chiplet Momentum Rising
By Mark LaPedus - 26 Feb, 2020 - Comments: 0

The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Testing Analog Chips
By Jeff Dorsch - 05 Feb, 2018 - Comments: 0

The world of analog components is broad and diverse, and while testing analog chips may not take as long as running tests on complex SoCs, there are different requirements for analog devices. One type of chip that's seeing more application these days is analog microelectromechanical system devices. Automotive electronics call for a number of [getkc id="37" kc_name="analog"] chips, along with... » read more

Manufacturing Bits: Oct. 29
By Mark LaPedus - 29 Oct, 2013 - Comments: 0

Diamond chips The optical transistor, which transports photons, holds great promise. Photons are not only faster than electrons, but they have less crosstalk. But optical transistors are also expensive and difficult to produce. In a possible breakthrough, the ICFO-Institute of Photonic Sciences has demonstrated a “nano-size” diamond that can act as an efficient optical switch. Researche... » read more

RTL Signoff
By Ed Sperling - 03 Jun, 2013 - Comments: 0

Piyush Sancheti, Atrenta's vice president of product marketing, talks with Low-Power/High-Performance Engineering about where the pain points are in design and why RTL signoff has become so important. [youtube vid=8Ra1_VmzW50] » read more

FinFETs On SOI
By Ed Sperling - 13 May, 2013 - Comments: 0

Soitec's Steve Longoria talks with Semiconductor Manufacturing and Design about what's changing at the leading edge of Moore's Law and why those changes are necessary. [youtube vid=K6D39QqJWSU] » read more

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