tag: TSMC

Developing A New Curvilinear Data Format
By Jan Willis - 17 Jun, 2021 - Comments: 0

The data size generated by curvilinear masks could impact turnaround time (TAT) for photomask production and hence the adoption of curvilinear masks. In a previous blog on curvilinear masks, our panel of luminaries discuss some possible solutions in a video discussion. In this seventh video, the panel looks at some ideas to define a new curvilinear data format to reduce file sizes. Aki Fujimura... » read more

Advancing 3D Integration
By Paul McLellan - 10 Jun, 2021 - Comments: 0

Jerry Tzou's recent presentation on 3D Fabric Technology was all about More than Moore. TSMC has other specialized technologies such as RF and eNVM, but this is a general foundational technology for hyperscale data centers, mobile, and AI. Jerry started with the motivation for using chiplets and heterogeneous chip integration. You can see in the diagram below on the left where die from node... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Jun, 2021 - Comments: 0

Government policy The Malaysian government has extended its lockdown due to the pandemic until June 14, a move that may impact the global electronics supply chain, according to TrendForce. Malaysia recently implemented MCO 3.0 (Movement Control Order), the nation’s pandemic control measure. Malaysia is home to many fab equipment, packaging and testing facilities, as well as passive compon... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Jun, 2021 - Comments: 0

Siemens Digital Industries Software acquired Nextflow Software, a provider of advanced particle-based computational fluid dynamics (CFD) solutions. Nextflow Software will become part of the Simcenter software portfolio, providing rapid meshless CFD capabilities to accelerate the analysis of complex transient applications in the automotive, aerospace, and marine industries such as gear box lubri... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 04 Jun, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back To simplify IoT workflows, Arm announced that it is putting parts of its Common Microcontroller Software Interface Standard (CMSIS) into an open project called Open-CMSIS-Pack. The CMSIS is a vendor-independent abstraction layer for MCUs, especially Arm Cortex-M processors, that makes it possible for developers to deal with softwa... » read more

How Will The Adoption Of Curvilinear Masks Affect Turnaround Time?
By Jan Willis - 01 Jun, 2021 - Comments: 0

Turnaround time (TAT) for photomask makers has historically increased at smaller and smaller process nodes, as reported in the eBeam Initiative Mask Makers surveys, so it’s important to look at the impact of curvilinear masks on TAT. In this sixth installment of our blog series on curvilinear masks, Aki Fujimura of D2S explores this question with luminaries in the industry during a video pane... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 May, 2021 - Comments: 0

Government policy The U.S. government hopes to build more fabs and expand its R&D efforts in the United States. To help enable those efforts, U.S. Senate Majority Leader Charles Schumer has introduced the new bipartisan U.S. Innovation and Competition Act. This combines Schumer’s Endless Frontier Act and other bipartisan competitiveness bills. It includes $52 billion in emergency supplem... » read more

Week In Review: Design, Low Power
By Jesse Allen - 28 May, 2021 - Comments: 0

Valens Semiconductor will become a publicly traded company on NYSE as VLN after a merger with PTK Acquisition Corp. Valens provides long-reach, high-speed video and data transmission for the audio-video and automotive industries. The transaction is expected to provide proceeds of approximately $240 million, including up to $115 million in trust from PTK Acquisition Corp. (assuming no redemption... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 28 May, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Cadence announced it has found a cost-conscience way to scale capacity for 3D electromagnetic (EM) simulations using a hybrid cloud consisting of local computing resources and cloud services from Amazon Web Service (AWS). Data stays safe on the local resources, and, if more computing resources are needed, encrypted simulation-spec... » read more

The Increasingly Uneven Race To 3nm/2nm
By Mark LaPedus and Ed Sperling - 24 May, 2021 - Comments: 2

Several chipmakers and fabless design houses are racing against each other to develop processes and chips at the next logic nodes in 3nm and 2nm, but putting these technologies into mass production is proving both expensive and difficult. It's also beginning to raise questions about just how quickly those new nodes will be needed and why. Migrating to the next nodes does boost performance an... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy