tag: TSMC

Monitoring IC Abnormalities Before Failures
By Anne Meixner - 07 Jul, 2020 - Comments: 0

The rising complexities of semiconductor processes and design are driving an increasing use of on-chip monitors to support data analytics from an IC’s birth through its end of life — no matter how long that projected lifespan. Engineers have long used on-chip circuitry to assist with manufacturing test, silicon debug and failure analysis. Providing visibility and controllability of inter... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Jul, 2020 - Comments: 0

Fab tools, packaging/test VLSI Research has released its 200mm wafer fab equipment (WFE) market share figures for 2019. The top three suppliers--Applied Materials, TEL, and ASML—saw growth in the 2019 200mm WFE business. Lam Research was in fourth place, followed by KLA and Canon. In total, 200mm wafer fab equipment sales were $3.6 billion in 2019, declining 5% from 2018, according to the fi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Jun, 2020 - Comments: 0

Fast Arm-based supercomputer Japan has taken the lead in the supercomputer race, jumping ahead of the U.S. But China continues to make its presence felt in the arena. Fugaku, an ARM-based supercomputer jointly developed by Japan’s Riken and Fujitsu, is now ranked the world’s fastest supercomputer in the 55th TOP500 list. Fugaku turned in a high performance Linpack (HPL) result of 415.5... » read more

China Speeds Up Advanced Chip Development
By Mark LaPedus - 22 Jun, 2020 - Comments: 18

China is accelerating its efforts to advance its domestic semiconductor industry, amid ongoing trade tensions with the West, in hopes of becoming more self-sufficient. The country is still behind in IC technology and is nowhere close to being self-reliant, but it is making noticeable progress. Until recently, China’s domestic chipmakers were stuck with mature foundry processes with no pres... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Jun, 2020 - Comments: 0

Chipmakers and OEMs At next week’s Apple Worldwide Developers Conference, Apple is expected to roll out its long-awaited Arm-based Mac computers. This could provide a boost for Apple’s foundry vendor as well as equipment makers. It’s the worst-kept secret in the industry. As reported by the Apple sites, Apple is moving from Intel’s microprocessors to its own Arm-based chips for th... » read more

Week In Review: Design, Low Power
By Jesse Allen - 19 Jun, 2020 - Comments: 0

Tools & IP Rambus debuted 112G XSR/USR PHY IP on TSMC's N7 7nm process. The PHY IP enables die-to-die and die-to-optical engine connectivity for chiplets and co-packaged optics targeting data center, networking, 5G, HPC, and AI/ML applications. It has been demonstrated in silicon to exceed the reach/BER performance of the CEI-112G XSR specification and supports NRZ and PAM-4 signaling at v... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 19 Jun, 2020 - Comments: 0

Security Many IoT devices have some of the 19 bugs known as Ripple20 vulnerabilities. Researchers JSOF discovered the security flaws in library produces by Treck, Inc., which is used in many IoT devices. Edge, cloud, data center Rambus delivered its 112G XSR/USR PHY IP on TSMC 7nm process (N7). The SerDes PHY was designed for chiplets and co-packaged optics (CPO) architectures that are des... » read more

The Next Advanced Packages
By Mark LaPedus - 18 Jun, 2020 - Comments: 4

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. These packages include new versions of 2.5D/3D technologies, chiplets, fan-out and even wafer-scale packaging. A given package type may include several variations. For example, vendors are developing new fan-out packages using wafers and panels. One is... » read more

Pandemics And Panic Chip Buying
By Mark LaPedus - 18 Jun, 2020 - Comments: 0

U.S.-China trade tensions are creating uncertainty in the semiconductor market, but it is also causing another event right now—panic chip buying. At present, some but not all foundry vendors are seeing “rush orders” for select products and are running their fabs at full capacity. It’s not just leading-edge devices, but also mature technologies. A surge of chip orders started in Ma... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Jun, 2020 - Comments: 0

Chipmakers Jim Keller, senior vice president in the Technology, Systems Architecture and Client Group (TSCG) and general manager of the Silicon Engineering Group (SEG) at Intel, has resigned amid a major reorganization at the company. Here's one report about the situation. Cree as well as China’s Yutong Group and StarPower are working together to accelerate the commercial adoption of sili... » read more

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