Manufacturing Bits: May 26

By Mark LaPedus - 26 May, 2020 - Comments: 0

7-level nanosheets The 2020 Symposia on VLSI Technology & Circuits for the first time will be held as a virtual conference. The event, to be held from June 15-18, is organized around the theme “The Next 40 Years of VLSI for Ubiquitous Intelligence.” Among the papers at the event include advanced nanosheet transistors, 3D stacked memory devices and even an artificial iris. At the ... » read more

Latest IC Outlook: More Uncertainty

By Mark LaPedus - 26 May, 2020 - Comments: 0

So far in 2020, it’s been a difficult period in the semiconductor industry amid the Covid-19 pandemic outbreak and other issues. And heading into the second half of 2020, the industry faces more challenges, if not uncertainty, in the market. Many segments in the semiconductor industry face some headwinds, but there might be some positive news in the equipment business. To be sure,... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 22 May, 2020 - Comments: 0

Chipmakers and OEMs Senator Patrick Leahy (D-Vt.), Senator Chuck Schumer (D-N.Y.) and Senator Jack Reed (D-R.I.) have sent a letter to officials from the Trump administration, demanding answers about TSMC’s recent announcement to build a fab in Ariz. As reported, TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, w... » read more

Week In Review: Design, Low Power

By Jesse Allen - 22 May, 2020 - Comments: 0

Tools & IP Cadence unveiled ten two verification IP (VIP) to support hyperscale data centers, automotive, and consumer and mobile applications. The new VIPs include complete bus functional models, integrated protocol checks and coverage models, and a specification-compliant verification plan. The VIPs cover CXL, HBM3, Ethernet 802.3ck, CSI-2 3.0, MIPI I3C 1.1, TileLink, eUSB2, UFS 3.1, MIP... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 22 May, 2020 - Comments: 0

Edge, cloud, data center Cadence added new verification IP (VIP) for hyperscalar data centers that supports CXL – Compute Express Link, HBM3, and Ethernet 802.3ck. The VIP are part of Cadence’s Verification Suite. Cadence also released IP for 56G long-reach SerDes on TSMC’s N7 and N6 process technologies. Many Mentor, a Siemens Business, IC design tools are now certified TSMC’s N5 a... » read more

EUV’s Uncertain Future At 3nm And Below

By Mark LaPedus - 21 May, 2020 - Comments: 5

Several foundries have moved extreme ultraviolet (EUV) lithography into production at both 7nm and 5nm, but now the industry is preparing for the next phase of the technology at 3nm and beyond. In R&D, the industry is developing new EUV scanners, masks and resists for the next nodes. 3nm is slated for 2022, followed by 2nm a year or two later. Nonetheless, it will require massive funding... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 15 May, 2020 - Comments: 0

Chipmakers TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, will utilize TSMC’s 5nm technology and will produce 20,000 wafers per month. TSMC’s total spending on this project will be approximately $12 billion from 2021 to 2029. Construction is planned to start in 2021 with production targeted to begin in 202... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 15 May, 2020 - Comments: 0

Security Ninety-one percent of commercial applications contain outdated or abandoned open-source components —a security threat, says Synopsys in its recently released report 2020 Open Source Security and Risk Analysis (OSSRA). In the fifth annual edition of the report, Synopsys’ research team in its Cybersecurity Research Center (CyRC) found that 99% of the 1,250 commercial codebases revie... » read more

Big Changes For eFPGAs

By Ed Sperling - 11 May, 2020 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks with Semiconductor Engineering about the state of embedded FPGAs, why this is easier for some companies than others, why this is important for adding flexibility into an ASIC, and what are the main applications for this technology. » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 08 May, 2020 - Comments: 0

Chipmakers The Trump administration has held talks with Intel and TSMC to build more leading-edge fabs in the U.S., according to the Wall Street Journal and other news outlets. IC Insights has released its rankings of the top-10 chip vendors in terms of sales for the first quarter. Intel remains in first place, followed by Samsung and TSMC. The big surprise is China-based fabless IC supplie... » read more

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tag: TSMC

Manufacturing Bits: May 26

Latest IC Outlook: More Uncertainty

Week In Review: Manufacturing, Test

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

EUV’s Uncertain Future At 3nm And Below

Week In Review: Manufacturing, Test

Week In Review: Auto, Security, Pervasive Computing

Big Changes For eFPGAs

Week In Review: Manufacturing, Test

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Knowledge Centers
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