tag: TSMC

Leveraging Data In Chipmaking
By Ed Sperling - 12 Nov, 2019 - Comments: 0

John Kibarian, president and CEO of PDF Solutions, sat down with Semiconductor Engineering to talk about the impact of data analytics on everything from yield and reliability to the inner structure of organizations, how the cloud and edge will work together, and where the big threats are in the future. SE: When did you recognize that data would be so critical to hardware design and manufact... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Nov, 2019 - Comments: 0

Chipmakers The IC industry once had several leading-edge vendors that invested and built new fabs. But over time, the field has narrowed due to soaring costs and a dwindling customer base. In 1994, the share of semiconductor industry capital spending held by the top five companies was 25%, according to IC Insights. This meant that a number of companies invested and built new fabs during the... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Nov, 2019 - Comments: 0

Chipmakers China has created a new $29 billion fund to help advance its semiconductor sector, according to reports from Bloomberg and others. Here's another report. The The U.S. and China are in the midst of a trade war. This has prompted China to accelerate its efforts to become more self-sufficient in semiconductor design and production. This includes DRAMs as well as logic/foundry. -----... » read more

Migrating 3D Into The Mainstream
By Brian Bailey - 31 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch - 25 Oct, 2019 - Comments: 0

Products/Services Rambus reports completing the sale of its Payments and Ticketing businesses to Visa for $75 million in cash. “With 30 years of experience pushing the envelope in semiconductor design, we look toward a future of continued innovation to carry on our mission of making data faster and safer,” Rambus President and CEO Luc Seraphin said in a statement. “Completing this transa... » read more

IP Management And Development At 5/3nm
By Ann Mutschler - 24 Oct, 2019 - Comments: 1

The growing complexity of moving to new process nodes is making it much more difficult to create, manage and re-use IP. There are more rules, more data to manage, and more potential interactions as density increases, both in planar implementations and in advanced packaging. And the problems only get worse as designs move to 5nm and 3nm, and as more heterogeneous components such as accelerato... » read more

Power Semi Wars Begin
By Mark LaPedus - 23 Oct, 2019 - Comments: 1

Several vendors are rolling out the next wave of power semiconductors based on gallium nitride (GaN) and silicon carbide (SiC), setting the stage for a showdown against traditional silicon-based devices in the market. Power semiconductors are specialized transistors that incorporate different and competitive technologies like GaN, SiC and silicon. Power semis operate as a switch in high-volt... » read more

Making Random Variation Less Random
By Ed Sperling - 21 Oct, 2019 - Comments: 0

The economics for random variation are changing, particularly at advanced nodes and in complex packaging schemes. Random variation always will exist in semiconductor manufacturing processes, but much of what is called random has a traceable root cause. The reason it is classified as random is that it is expensive to track down all of the various quirks in a complex manufacturing process or i... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Oct, 2019 - Comments: 0

Chipmakers The semiconductor capital spending race continues to escalate in the leading-edge logic space. Intel and Samsung have separately announced big capital spending plans in 2019. Intel’s latest CapEx budget is $15.5 billion in 2019, while Samsung’s CapEx is slated for $16.204 billion for the year, according to KeyBanc Capital Markets. Now, TSMC is raising the stakes. TSMC this... » read more

What’s The Best Advanced Packaging Option?
By Mark LaPedus - 17 Oct, 2019 - Comments: 2

As traditional chip designs become more unwieldy and expensive at each node, many IC vendors are exploring or pursuing alternative approaches using advanced packaging. The problem is there are too many advanced packaging options on the table already, and the list continues to grow. Moreover, each option has several tradeoffs and challenges, and all of them are still relatively expensive. ... » read more

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