tag: TSMC

5 Observations From Intel’s Event
By Mark LaPedus - 17 Dec, 2018 - Comments: 0

Not long ago, Intel hosted its “Architecture Day,” where top executives from the chip giant revealed the company’s latest products and next-generation technologies. The company also discussed its strategy. To be sure, it’s a critical time for Intel. In June, Brian Krzanich was forced out as chief executive and the company is still looking for a permanent CEO. Plus, Intel has delayed it... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Dec, 2018 - Comments: 2

Intel Mark Bohr, a senior fellow and director of process architecture and integration at Intel, is retiring, according to the company. Bohr, who will retire at the end of February 2019, held various technology positions during his 41-year career at Intel. Here is a quick bio on Bohr. Others have also recently retired from Intel’s manufacturing unit amid a massive reorganization in the depart... » read more

Manufacturing Bits: Dec. 11
By Mark LaPedus - 11 Dec, 2018 - Comments: 0

FinFET vs. FD-SOI pH sensors At the recent 2018 IEEE International Electron Devices Meeting (IEDM), TSMC and National Tsing Hua University presented a paper on an ion detector or pH sensor based on a 16nm finFET technology. Researchers have developed an advanced version of an ion-sensitive field-effect transistor (ISFET). Originally developed in the 1970s, ISFETs are pH sensors that are use... » read more

Packaging Biz Faces Challenges in 2019
By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Where Advanced Packaging Makes Sense
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Dec, 2018 - Comments: 0

Fab tools/manufacturing Lam Research has accepted Martin Anstice’s resignation as chief executive and a member of the board. Lam has named Tim Archer as president and chief executive effective immediately. Archer, who served as Lam’s president and chief operating officer, has been named to the board. One analyst provided a comment on the situation at Lam. “In our view, Mr. Archer is very... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 30 Nov, 2018 - Comments: 0

Internet of Things Lowe’s, the home improvement retailer, is giving up on the smart home market. The company is putting its Iris Smart Home business up for sale as part of a reorganization. The retailer made a big splash at CES 2015 with its Innovation Lab offerings, which included retail service robots and the Holoroom “home improvement simulator.” The Iris product line includes multipl... » read more

Physical Verification In The Cloud
By Manoz Palaparthi - 29 Nov, 2018 - Comments: 0

Cloud computing is no longer “the next big thing”; it has become a mainstream tool for business across many industries. Our own industry of IC Design and EDA, however, has been watching the cloud trend closely from the sidelines. We have been cautious and have not embraced Cloud as much as other industries – until now. What changed this year? What is driving design companies and EDA tool ... » read more

Foundries Prepare For Battle At 22nm
By Mark LaPedus - 19 Nov, 2018 - Comments: 0

After introducing new 22nm processes over the last year or two, foundries are gearing up the technology for production—and preparing for a showdown. GlobalFoundries, Intel, TSMC and UMC are developing and/or expanding their efforts at 22nm amid signs this node could generate substantial business for applications like automotive, IoT and wireless. But foundry customers face some tough choic... » read more

2 Big Shifts, Lots Of Questions
By Ed Sperling - 15 Nov, 2018 - Comments: 0

The proliferation of AI everywhere, and ongoing efforts by big systems companies to develop their own chips, could have a profound effect on semiconductor manufacturing for years to come. AI is a multi-faceted topic, but what makes this particularly interesting from a semiconductor standpoint is the architecture of AI-specific chips. So far, most of these chips have been developed for data c... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy