Chip Industry Technical Paper Roundup: June 17


New technical papers recently added to Semiconductor Engineering’s library: [table id=440 /] Find more semiconductor research papers here.   » read more

The Impact Of Parameter Uncertainties On The Lifetime Prediction of Power Devices (TU Delft)


A new technical paper titled "Impact of Parameter Uncertainties on Power Electronic Device Lifetime Predictions" was published by researchers at TU Delft. Abstract "Properly addressing uncertainties in reliability analysis is essential for realistic lifetime predictions of power devices. This paper investigates parameter uncertainties on the lifetime estimation of power devices using an emp... » read more

Chip Industry Week in Review


The U.S. Commerce Department is tightening controls on EDA software sold to China by imposing additional license requirements. EDA companies are assessing the impact. Details on how broad the restrictions will be are still pending. The U.S. Federal Trade Commission (FTC) will require Synopsys and Ansys to divest key software assets — including optical, photonic, and RTL power analysis tool... » read more

Med Tech Morphs Into Consumer Wearables


Doctors have been using advanced technology for years, but the growing trend is for consumers to use devices at home and have direct access to their data. Watches and rings that were once primarily used for counting steps or registering sleep patterns can now read blood pressure, heart rate, blood oxygen, body temperature, and other early signs of illness. Meanwhile, various patches are under d... » read more

Chip Industry Week In Review


Analog Devices acquired Flex Logix's technology assets, along with its technical team. Semiconductor global sales increased 23% in Q3 2024 $166B, up almost 11% versus the same period in 2023, according to SIA. Notable regional year-to-year sales in September: Americas up 46%, China up 23%, Europe down 8%. Fig.1: Worldwide Semiconductor Revenues, year-to-year % change. Source: Semiconduc... » read more

Chip Industry Week In Review


Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

Chip Industry Technical Paper Roundup: April 2


New technical papers recently added to Semiconductor Engineering’s library. [table id=211 /] Find last week’s technical paper additions here. » read more

Optimizing Event-Based Neural Network Processing For A Neuromorphic Architecture


A new technical paper titled "Optimizing event-based neural networks on digital neuromorphic architecture: a comprehensive design space exploration" was published by imec, TU Delft and University of Twente. Abstract "Neuromorphic processors promise low-latency and energy-efficient processing by adopting novel brain-inspired design methodologies. Yet, current neuromorphic solutions still str... » read more

Chip Industry Technical Paper Roundup: Jan 2


New technical papers added to Semiconductor Engineering’s library this week. [table id=180 /] More ReadingTechnical Paper Library home » read more

Analog Planar Memristor Device: Developing, Designing, and Manufacturing


A new technical paper titled "Analog monolayer SWCNTs-based memristive 2D structure for energy-efficient deep learning in spiking neural networks" was published by researchers at Delft University of Technology and Khalifa University. Abstract: "Advances in materials science and memory devices work in tandem for the evolution of Artificial Intelligence systems. Energy-efficient computation... » read more

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