System Bits: March 13

By Ann Mutschler - 13 Mar, 2018 - Comments: 0

Wiring quantum computers According to MIT researchers, when we talk about “information technology,” we generally mean the technology part, like computers, networks, and software. But they reminded that the information itself, and its behavior in quantum systems, is a central focus for MIT’s interdisciplinary Quantum Engineering Group (QEG) as it seeks to develop quantum computing and oth... » read more

Heterogeneous Hubbub

By Ann Mutschler - 08 Mar, 2018 - Comments: 0

It’s no secret that designers today would prefer not to be restricted in their architectural choices. And who can blame them? At the same time, this sentiment has boosted interest and usage of both heterogenous architectures as well as the RISC-V ISA. To support this, companies across the design, test and verification ecosystem are ramping efforts. One such effort is the teaming of UltraSo... » read more

Finding Faulty Auto Chips

By Mark LaPedus - 05 Mar, 2018 - Comments: 1

The next wave of automotive chips for assisted and autonomous driving is fueling the development of new approaches in a critical field called outlier detection. KLA-Tencor, Optimal+, as well as Mentor, a Siemens Business, and others are entering or expanding their efforts in the outlier detection market or related fields. Used in various industries for several years, outlier detection is one... » read more

RISC-V Gains Its Footing

By Ann Mutschler - 26 Feb, 2018 - Comments: 3

The RISC-V instruction-set architecture, which started as a UC Berkeley project to improve energy efficiency, is gaining steam across the industry. The RISC-V Foundation's member roster gives an indication who is behind this effort. Members include Google, Nvidia, Qualcomm, Rambus, Samsung, NXP, Micron, IBM, GlobalFoundries, UltraSoC, Siemens, among many others. One of the key markets for... » read more

System Bits: Feb. 13

By Ann Mutschler - 13 Feb, 2018 - Comments: 0

Enabling individual manufacturing apps Researchers at the Fraunhofer Institute for Computer Graphics Research IGD focused on Industrie 4.0 recognize that manufacturing is turning toward batch sizes of one and individualized production in what is sometimes referred to as ‘highly customized mass production.’ [caption id="attachment_24131609" align="aligncenter" width="300"] The scanning ... » read more

Power/Performance Bits: Jan. 23

By Jesse Allen - 23 Jan, 2018 - Comments: 0

Atomristors for thin memory Engineers at The University of Texas at Austin and Peking University developed a thin memory storage device with dense memory capacity. Dubbed "atomristors," the device enables 3-D integration of nanoscale memory with nanoscale transistors on the same chip. "For a long time, the consensus was that it wasn't possible to make memory devices from materials that were... » read more

A New Memory Contender?

By Mark LaPedus - 02 Jan, 2018 - Comments: 1

Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

System Bits: Jan. 2

By Ann Mutschler - 02 Jan, 2018 - Comments: 0

Robots imagine their future to learn By playing with objects and then imagining how to get the task done, UC Berkeley researchers have developed a robotic learning technology that enables robots to figure out how to manipulate objects they have never encountered before. The team expects this technology could help self-driving cars anticipate future events on the road and produce more intel... » read more

Chipmakers Look To New Materials

By Jeff Dorsch - 18 Dec, 2017 - Comments: 1

Graphene, the wonder material rediscovered in 2004, and a host of other two-dimensional materials are gaining ground in manufacturing semiconductors as silicon’s usefulness begins to fade. And while there are a number of compounds in use already, such as gallium arsenide, gallium nitride, and silicon carbide, those materials generally are being confined to specific niche applications. Tran... » read more

Big Challenges, Changes For Debug

By Ann Mutschler - 04 Dec, 2017 - Comments: 1

By Ann Steffora Mutschler & Ed Sperling Debugging a chip always has been difficult, but the problem is getting worse at 7nm and 5nm. The number of corner cases is exploding as complexity rises, and some bugs are not even on anyone's radar until well after devices are already in use by end customers. An estimated 39% of verification engineering time is spent on debugging activities the... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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