tag: UMC

MEMS: A Tale Of Two Tough Markets
By Ed Sperling - 22 Feb, 2017 - Comments: 0

The MEMS market is growing rapidly, profits not so much. In most market segments, this would be a signal that more automation and standardization are required. But in the microelectromechanical systems world, fixes aren't so simple. And even where something can be automated, that automation doesn't work all the time. In fact, while MEMS devices are extremely difficult to design, build and ma... » read more

Semiconductor CapEx To Increase 4.3% In 2017
By Adrienne Downey - 20 Feb, 2017 - Comments: 0

Semiconductor capital expenditures are an important bellwether for the industry. Based on preliminary findings, Semico Research predicts 2017’s total will increase 4.3% to $69.7 billion, a record high, and a slightly larger increase than in 2016. Semico tracks more than 80 companies for CapEx and R&D spending, although many of those companies have merged, have been acquired, or gone ba... » read more

Get Ready For Nanotube RAM
By Mark LaPedus - 20 Feb, 2017 - Comments: 6

The memory market is going in several different directions at once. On one front, the traditional memory types, such DRAM and flash, remain the workhorse technologies in systems despite undergoing some changes in the business. Then, several vendors are readying the next-generation memory types in the market. As part of an ongoing series, Semiconductor Engineering will explore where the new a... » read more

What’s Next For NOR Flash?
By Mark LaPedus - 16 Feb, 2017 - Comments: 0

The flash memory market is the tale two of cities. Today, NAND and NOR are the two main flash memory types. Over the years, the NAND flash market has exploded. Targeted for data storage, NAND flash has moved into flash cards, solid-state storage drives (SSDs) and other products. The excitement for NAND continues to mount, as the technology is moving from planar to a 3D structure. In fact, 3D... » read more

China Moves To Top Spot In Fab Equipment Spending
By Clark Tseng - 16 Feb, 2017 - Comments: 0

By Clark Tseng, Dan Tracy & Gavin Wang of SEMI With 20, and possibly more, new fab projects underway or announced in China since 2016, spending on fab equipment will surge to $10 billion or more, annually, by 2018 and to even higher levels in the following two years. As a result, China is projected to be the top spending region for fab equipment in 2019 and 2020. Robert Maire, of Semicon... » read more

Better Chips, Better Cars
By Yan Qu - 16 Feb, 2017 - Comments: 0

There are literally thousands of electronic components in a new car, and those numbers are only going to increase as cars become smarter, safer, greener, and increasingly connected. As automakers and Tier 1 and Tier 2 companies shift their focus from mechanical to a combination of mechanical and electrical, there is an ongoing race among fabless companies to come up with innovative technolog... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Feb, 2017 - Comments: 0

Chipmakers Intel has announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. The fab was announced several years ago, but Intel delayed the plant in 2014. Now, the plant, dubbed Fab 42, is moving forward again. Targeted for 7nm technology, Fab 42 will be completed in 3 to 4 years and will create approximately 3,000 jobs. The announcement was m... » read more

OSAT Biz: Growth And Challenges
By Mark LaPedus - 08 Feb, 2017 - Comments: 0

Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

BEOL Issues At 10nm And 7nm
By Ed Sperling - 31 Jan, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Jan, 2017 - Comments: 0

Chipmakers Faced with a huge write-down at its nuclear operations, Toshiba is looking to spin off its semiconductor division, which makes NAND. As expected, Toshiba seeks investors in the new company, according to Nikkei. Western Digital (WD) is one potential investor. Foxconn is another possible investor, according to CNBC. Peregrine Semiconductor has rolled out its latest RF SOI process.... » read more

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