tag: Université Catholique de Louvain

Research Bits: May 10
By Jesse Allen - 10 May, 2023 - Comments: 0

Growing 2D TMDs on chips Researchers from Massachusetts Institute of Technology (MIT), Oak Ridge National Laboratory, and Ericsson Research found a way to “grow” layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a fully fabricated silicon chip, a technique they say could enable denser integrations. The researchers focused on molybdenum disulfide, which is f... » read more

Chip Industry’s Technical Paper Roundup: Jan. 17
By Linda Christensen - 17 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library. [table id=74 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting li... » read more

Hardware Trojan Detection Case Study Based on 4 Different ICs Manufactured in Progressively Smaller CMOS Process Technologies
By Technical Paper Link - 11 Jan, 2023 - Comments: 0

A technical paper titled "Red Team vs. Blue Team: A Real-World Hardware Trojan Detection Case Study Across Four Modern CMOS Technology Generations" was published by researchers at Max Planck Institute for Security and Privacy, Université catholique de Louvain (Belgium), Ruhr University Bochum, and Bundeskriminalamt. "In this work, we aim to improve upon this state of the art by presenting a... » read more

System Bits: July 22
By Ann Mutschler - 22 Jul, 2014 - Comments: 0

All graphene is not the same Widely touted as the most electrically conductive material ever studied, researchers at the University of Pennsylvania now understand that all graphene is not the same. With so few atoms comprising the entirety of the material, the arrangement of each one has an impact on its overall function. The team has used an advanced microscope to study the relationship be... » read more

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