Research Bits: Jun. 2


Integrated valleytronics device Researchers from Monash University designed a valleytronics circuit that can generate, direct, and read light-based information on a single chip. Potential applications include quantum computing, advanced imaging, and optical communication systems. “We employ a straightforward stacking approach to integrate ultrathin materials with metasurfaces, overcoming ... » read more

Research Bits: May 11


Non-destructive terahertz inspection Researchers from Adelaide University, Virginia Diodes, the Hasso Plattner Institute, and the University of Potsdam used terahertz waves to observe electrical activity inside fully packaged semiconductor devices as they are operating. The technique relies on an ultra-sensitive detection system using a specialized homodyne quadrature receiver, which can pi... » read more

Replacing GPU Compute Dies With PNM-Enabled HBM Cubes For Long-Context Decode Attention (UCSD, Columbia, Yonsei U., NVIDIA, Samsung)


A new technical paper, "AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving," was published by researchers at UC San Diego, Columbia University, Yonsei University, NVIDIA, and Samsung. Abstract "All current LLM serving systems place the GPU at the center, from production-level attention-FFN disaggregation to NVIDIA's Rubin GPU-LPU heterogeneous p... » read more

Research Bits: Apr. 21


Compute-in-memory state space models Researchers from the University of Michigan mapped complex state space models directly onto a compute-in-memory architecture in an example of hardware-software co-design for edge AI. "Compute-in-memory systems offer very high energy efficiency and throughput, but they are rigid and not optimal for convolution and transformer networks. In this study, we s... » read more

Outlier-aware Quantization Framework Co-designed With Heterogeneous NVM For SLM Deployment on Edge Platforms (UCSD et al.)


  A new technical paper titled "QMC: Efficient SLM Edge Inference via Outlier-Aware Quantization and Emergent Memories Co-Design" was published by researchers at University of California San Diego and San Diego State University. Abstract "Deploying Small Language Models (SLMs) on edge platforms is critical for real-time, privacy-sensitive generative AI, yet constrained by memory, ... » read more

System-HW Co-Design Approach Combines Mono3D DRAM, NMP, and GPU Acceleration (UCSD, Georgia Tech, UIUC, Illinois Tech)


A new technical paper titled "Stratum: System-Hardware Co-Design with Tiered Monolithic 3D-Stackable DRAM for Efficient MoE Serving" was published by researchers at UC San Diego, Georgia Tech, University of Illinois Urbana-Champaign and Illinois Institute of Technology. Abstract "As Large Language Models (LLMs) continue to evolve, Mixture of Experts (MoE) architecture has emerged as a preva... » read more

Chip Industry Week in Review


The U.S. is considering annual approvals for Samsung and SK hynix to export chipmaking tools and materials to their factories in China, replacing perpetual waivers granted under the validated end user system, reports Bloomberg. The proposal, presented by the U.S. Commerce Department to South Korean officials, would require the companies to reapply each year for specific quantities of restricted... » read more

Chip Industry Week in Review


Microsoft, OpenAI, and NVIDIA warned about power swings and physical damage to power grids increasing from AI training workloads and jointly proposed a multi-pronged approach to stabilize power in AI training data centers. Meanwhile, Anthropic issued a warning about the weaponization of agentic AI in a new 25-page Threat Intelligence report. Key concerns involve the evolution in AI-assisted ... » read more

Chip Industry Week in Review


Intel reported flat year-over year revenue for Q2, exceeding Wall Street's pessimistic expectations. In a message to employees, CEO Lip-Bu Tan said the company will: Cut about 15% of its staff, ending the year with about 75,000 employees, down from a high of nearly 132,000 in 2022; Scrap projects in Poland and Germany, consolidate other sites in central America and Southeast Asia, and s... » read more

Chip Industry Week in Review


Texas Instruments will invest more than $60 billion to build and expand seven semiconductor fabs in Texas and Utah, supporting more than 60,000 U.S. jobs. Chinese automakers — including SAIC Motor, Changan, Great Wall Motor, BYD, Li Auto and Geely — are aiming to launch new models with 100% homemade chips, some as early as 2026, reports Nikkei Asia. Marvell introduced 2nm custom SRAM ... » read more

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