Energy-Aware DL: The Interplay Between NN Efficiency And Hardware Constraints (Imperial College London, Cambridge)


A new technical paper titled "Energy-Aware Deep Learning on Resource-Constrained Hardware" was published by researchers at Imperial College London and University of Cambridge. Abstract "The use of deep learning (DL) on Internet of Things (IoT) and mobile devices offers numerous advantages over cloud-based processing. However, such devices face substantial energy constraints to prolong batte... » read more

Chip Industry Week in Review


Check out the Inside Chips podcast for our behind-the-scenes analysis. Newly proposed U.S. legislation called the Chip Security Act would use location verification tracking as a tool to help combat chip smuggling. This follows a report by the Economist that showed Taiwan exports of advanced chips to Malaysia in the first quarter has nearly reached 2024 totals, heightening concerns that China... » read more

Chip Industry Week in Review


Check out the Inside Chips podcast for our behind-the-scenes analysis. The U.S. government is rescinding a Biden-era AI export rule that would have imposed complex restrictions on how U.S. chip and AI technology is sold abroad, a move welcomed by companies like Nvidia, reports Bloomberg. While new, simpler guidelines are expected in the coming months, the decision introduces short-term uncer... » read more

Chip Industry Technical Paper Roundup: Apr. 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=421 /] Find more semiconductor research papers here. » read more

Chip Industry Week In Review


Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast.  The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

2D Materials Roadmap: Current And Future Challenges, Solutions


A new technical paper titled "The 2D Materials Roadmap" was published by researchers at many institutions including Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al. Abstract "Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of th... » read more

Chip Industry Technical Paper Roundup: Apr. 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=419 /] Find more semiconductor research papers here. » read more

Side-by-Side Benchmark of NPU Platforms (Imperial College London, Cambridge)


A new technical paper titled "Benchmarking Ultra-Low-Power μNPUs" was published by researchers at Imperial College London and University of Cambridge. Abstract "Efficient on-device neural network (NN) inference has various advantages over cloud-based processing, including predictable latency, enhanced privacy, greater reliability, and reduced operating costs for vendors. This has sparked t... » read more

Chip Industry Week In Review


Semiconductor industry energy consumption grew 125% between 2015 and 2023, while direct greenhouse gas emissions rose 23% in the same period, according to the Europe think tank Interface, which analyzed corporate social responsibility reports from 28 global chip manufacturers. CSIS' new report "Understanding U.S. Allies’ Current Legal Authority to Implement AI and Semiconductor Export Cont... » read more

Research Bits: Mar. 4


Fiber computer Researchers from Massachusetts Institute of Technology (MIT), Rhode Island School of Design, and Brown University developed a programmable elastic fiber computer that could be woven into clothing to monitor health conditions and physical activity. Clothing created using the fiber computer was reported as comfortable and machine washable. The single elastic fiber computer cont... » read more

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