Chip Industry Week In Review


Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast.  The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

2D Materials Roadmap: Current And Future Challenges, Solutions


A new technical paper titled "The 2D Materials Roadmap" was published by researchers at many institutions including Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al. Abstract "Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of th... » read more

Chip Industry Technical Paper Roundup: Apr. 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=419 /] Find more semiconductor research papers here. » read more

Side-by-Side Benchmark of NPU Platforms (Imperial College London, Cambridge)


A new technical paper titled "Benchmarking Ultra-Low-Power μNPUs" was published by researchers at Imperial College London and University of Cambridge. Abstract "Efficient on-device neural network (NN) inference has various advantages over cloud-based processing, including predictable latency, enhanced privacy, greater reliability, and reduced operating costs for vendors. This has sparked t... » read more

Chip Industry Week In Review


Semiconductor industry energy consumption grew 125% between 2015 and 2023, while direct greenhouse gas emissions rose 23% in the same period, according to the Europe think tank Interface, which analyzed corporate social responsibility reports from 28 global chip manufacturers. CSIS' new report "Understanding U.S. Allies’ Current Legal Authority to Implement AI and Semiconductor Export Cont... » read more

Research Bits: Mar. 4


Fiber computer Researchers from Massachusetts Institute of Technology (MIT), Rhode Island School of Design, and Brown University developed a programmable elastic fiber computer that could be woven into clothing to monitor health conditions and physical activity. Clothing created using the fiber computer was reported as comfortable and machine washable. The single elastic fiber computer cont... » read more

Chip Industry Technical Paper Roundup: Jan. 20


New technical papers recently added to Semiconductor Engineering’s library: [table id=398 /] Find all technical papers here. » read more

Domain Wall Fluctuations in Sliding Ferroelectrics (Cambridge, Argonne)


A new technical paper titled "Superconductivity from Domain Wall Fluctuations in Sliding Ferroelectrics" was published by researchers at University of Cambridge and Argonne National Lab. Abstract: "Bilayers of two-dimensional van der Waals materials that lack an inversion center can show a novel form of ferroelectricity, where certain stacking arrangements of the two layers lead to an inter... » read more

Chip Industry Week In Review


The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from: imec: Proposed a new CFET-based standard cell architecture for the A7 node containing two rows of CFETs with a shared signal routing wall in between, allowing standard cell heights to be reduced from 4 to 3.5T, compared to single-row CFETs. Integrated indium pho... » read more

Chip Industry Week In Review


SK hynix started mass production of 1-terabit  321-high NAND, with availability scheduled for the first half of next year. Rapidus will receive an additional ¥200 billion yen ($1.28B) from the Japanese government beginning in fiscal year 2025, reports Nikkei. This is on top of ¥920 billion yen ($5.98B) Rapidus has already received from the government in support of its goal to reach commer... » read more

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