Chip Industry Week in Review

By The SE Staff - 02 Aug, 2024 - Comments: 0

Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Chip Industry Technical Paper Roundup: May 21

By Linda Christensen - 21 May, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=227 /] More ReadingTechnical Paper Library home » read more

Tweaking Isotopes In Thin Semiconductor Materials Can Influence Optical And Electronic Properties

By Technical Paper Link - 14 May, 2024 - Comments: 0

A technical paper titled “Anomalous isotope effect on the optical bandgap in a monolayer transition metal dichalcogenide semiconductor” was published by researchers at Oak Ridge National Laboratory (ORNL) and University of Central Florida. Abstract: "Isotope effects have received increasing attention in materials science and engineering because altering isotopes directly affects phonons, ... » read more

Chip Industry Week In Review

By The SE Staff - 03 May, 2024 - Comments: 0

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

Maximizing Edge Intelligence Requires More Than Computing

By Toshikazu Nishida - 16 Nov, 2023 - Comments: 0

By Toshi Nishida, Avik W. Ghosh, Swaminathan Rajaraman, and Mircea Stan Commercial-off-the-shelf (COTS) components have enabled a commodity market for Wi-Fi-connected appliances, consumer products, infrastructure, manufacturing, vehicles, and wearables. However, the vast majority of connected systems today are deployed at the edge of the network, near the end user or end application, opening... » read more

Chip Industry’s Technical Paper Roundup: Jan 3

By Linda Christensen - 03 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=72 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Multi-Wavelength, Multimode Communication Scheme For On-Chip and Chip-to-Chip Interconnects

By Technical Paper Link - 02 Jan, 2023 - Comments: 0

A technical paper titled "Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs" was published by researchers at Stanford, Harvard, University of Central Florida, NIST, and others. "Here we demonstrate an integrated multi-dimensional communication scheme that combines wavelength- and mode- multiplexing on a silicon photonic circuit. Using foundry-compati... » read more

Research Bits: Nov. 7

By Jesse Allen - 07 Nov, 2022 - Comments: 0

ADC side-channel attacks Researchers at MIT propose two ways to protect analog-to-digital converters (ADCs) from power and electromagnetic side-channel attacks. The researchers first investigated the side-channel attacks that could be used against ADCs. Power attacks usually involve an attacker soldering a resistor onto the device’s circuit board to measure its power usage. An electromagn... » read more

Chip Industry’s Technical Paper Roundup: Nov. 1

By Linda Christensen - 01 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=61 /] » read more

New Class of Electrically Driven Optical Nonvolatile Memory

By Technical Paper Link - 26 Oct, 2022 - Comments: 0

A new technical paper titled "Electrical Programmable Multi-Level Non-volatile Photonic Random-Access Memory" was published by researchers at George Washington University, Optelligence, MIT, and the University of Central Florida. Researchers demonstrate "a multi-state electrically-programmed low-loss non-volatile photonic memory based on a broadband transparent phase change material (Ge2Sb2S... » read more

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