Chip Industry Week In Review

By The SE Staff - 11 Apr, 2025 - Comments: 0

Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast. The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

2D Materials Roadmap: Current And Future Challenges, Solutions

By Technical Paper Link - 08 Apr, 2025 - Comments: 0

A new technical paper titled "The 2D Materials Roadmap" was published by researchers at many institutions including Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al. Abstract "Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of th... » read more

Chip Industry Technical Paper Roundup: Mar. 25

By Linda Christensen - 25 Mar, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=415 /] Find more semiconductor research papers here. » read more

Energy-Efficient Scalable Silicon Photonic Platform For AI Accelerator HW

By Technical Paper Link - 12 Mar, 2025 - Comments: 0

A new technical paper titled "Large-Scale Integrated Photonic Device Platform for Energy-Efficient AI/ML Accelerators" was published by researchers at HP Labs, IIT Madras, Microsoft Research and University of Michigan. Abstract "The convergence of deep learning and Big Data has spurred significant interest in developing novel hardware that can run large artificial intelligence (AI) workload... » read more

Thermal-Aware DSE Framework for 3DICs, With Advanced Cooling Models

By Technical Paper Link - 11 Mar, 2025 - Comments: 0

A new technical paper titled "Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs" was published by researchers at University of Michigan, Shanghai Jiao Tong University and University of Virginia. Abstract "The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design spa... » read more

Chip Industry Week In Review

By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Chip Industry Week In Review

By The SE Staff - 24 Jan, 2025 - Comments: 0

The new Trump administration was quick to put a different stamp on the tech world: President Trump rescinded a long list of Biden’s executive orders, including those aimed at AI safety and the mandate for 50% EVs by 2030. Roughly 1.3 million EVs were sold in the U.S. in 2024, up 7.3% from 2023. The new administration announced $500 billion ($100 billion initially) in private sector in... » read more

Research Bits: Jan. 13

By Jesse Allen - 13 Jan, 2025 - Comments: 0

High-temp electrochemical memory Researchers from the University of Michigan and Sandia National Laboratory propose a nonvolatile electrochemical memory that can store and rewrite information at temperatures over 1100°F (600°C), enabling it to continue working in environments as extreme as the surface of Venus. Instead of transporting electrons, the memory moves oxygen ions between layere... » read more

Chip Industry Technical Paper Roundup: Dec. 23

By Linda Christensen - 23 Dec, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=394 /] Find all technical papers here. » read more

Nonvolatile Electrochemical Memory Cell For Temperatures Up To 600°C (U. Of Michigan, Sandia)

By Technical Paper Link - 18 Dec, 2024 - Comments: 0

A new technical paper titled "Nonvolatile electrochemical memory at 600°C enabled by composition phase separation" was published by researchers at University of Michigan and Sandia National Laboratories. "Moore’s law has led to monumental advances in computing over the past 50 years. However, one shortcoming of silicon-based logic and memory devices is their limited temperature range, typ... » read more

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tag: University of Michigan

Chip Industry Week In Review

2D Materials Roadmap: Current And Future Challenges, Solutions

Chip Industry Technical Paper Roundup: Mar. 25

Energy-Efficient Scalable Silicon Photonic Platform For AI Accelerator HW

Thermal-Aware DSE Framework for 3DICs, With Advanced Cooling Models

Chip Industry Week In Review

Chip Industry Week In Review

Research Bits: Jan. 13

Chip Industry Technical Paper Roundup: Dec. 23

Nonvolatile Electrochemical Memory Cell For Temperatures Up To 600°C (U. Of Michigan, Sandia)

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