tag: University of Michigan

Chip Industry’s Technical Paper Roundup: Feb. 14
By Linda Christensen - 14 Feb, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=80 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Nanoscale (5nm) Ferroelectric Semiconductor (University of Michigan)
By Technical Paper Link - 08 Feb, 2023 - Comments: 0

A new technical paper titled "Thickness scaling down to 5 nm of ferroelectric ScAlN on CMOS compatible molybdenum grown by molecular beam epitaxy" was published by researchers at University of Michigan, with DARPA funding. "Ferroelectric semiconductors stand out from others because they can sustain an electrical polarization, like the electric version of magnetism. But unlike a fridge magn... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 13 Jan, 2023 - Comments: 0

The head of the U.S. National Transportation Safety Board (NTSB), Jennifer Homendy, voiced concern about the impact of heavier electric vehicles (EVs) will have in crashes with smaller cars with internal combustion engines (ICEs). Homendy compared the weight of the GMC Hummer and the Ford F-150’s EV to ICE version and found the EVs are 2,000 to 6,000 pounds heavier. The extra weight in EVs is... » read more

Chip Industry’s Technical Paper Roundup: Jan 3
By Linda Christensen - 03 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=72 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Research Bits: Jan. 3
By Jesse Allen - 03 Jan, 2023 - Comments: 0

Printing electronics on curved surfaces Researchers from North Carolina State University have demonstrated a new technique for directly printing electronic circuits onto curved and corrugated surfaces. They have used the technique to create prototype “smart” contact lenses, pressure-sensitive latex gloves, and transparent electrodes. “There are many existing techniques for creating pr... » read more

Hardware Accelerator For Fully Homomorphic Encryption
By Technical Paper Link - 20 Dec, 2022 - Comments: 0

A technical paper titled "CraterLake: A Hardware Accelerator for Efficient Unbounded Computation on Encrypted Data" was published by researchers at MIT, IBM TJ Watson, SRI International, and University of Michigan. "We present CraterLake, the first FHE accelerator that enables FHE programs of unbounded size (i.e., unbounded multiplicative depth). Such computations require very large cipherte... » read more

Chip Industry’s Technical Paper Roundup: Dec. 20
By Linda Christensen - 20 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=71 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

Hardware Fuzzing (U. of Michigan, Google, Virginia Tech)
By Technical Paper Link - 18 Dec, 2022 - Comments: 0

A technical paper titled "Fuzzing Hardware Like Software" was published by researchers at University of Michigan, Google and Virginia Tech. The paper was presented at the 2022 Usenix Security Symposium. Abstract: "Hardware flaws are permanent and potent: hardware cannot be patched once fabricated, and any flaws may undermine even formally verified software executing on top. Consequently, ve... » read more

Chip Industry’s Technical Paper Roundup: Nov. 21
By Linda Christensen - 21 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

Profile-Guided HW/SW Mechanism To Efficiently Reduce Branch Mispredictions In Data Center Applications (Best Paper Award)
By Technical Paper Link - 17 Nov, 2022 - Comments: 0

A new technical paper titled "Whisper: Profile-Guided Branch Misprediction Elimination for Data Center Applications" was published by researchers at University of Michigan, ARM, University of California, Santa Cruz, and Texas A&M University. This work was awarded a best paper award at October's 2022 Institute of Electrical and Electronics Engineers (IEEE)/Association for Computing Machin... » read more

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