tag: University of Michigan

Hardware Accelerator For Fully Homomorphic Encryption
By Technical Paper Link - 20 Dec, 2022 - Comments: 0

A technical paper titled "CraterLake: A Hardware Accelerator for Efficient Unbounded Computation on Encrypted Data" was published by researchers at MIT, IBM TJ Watson, SRI International, and University of Michigan. "We present CraterLake, the first FHE accelerator that enables FHE programs of unbounded size (i.e., unbounded multiplicative depth). Such computations require very large cipherte... » read more

Chip Industry’s Technical Paper Roundup: Dec. 20
By Linda Christensen - 20 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=71 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

Hardware Fuzzing (U. of Michigan, Google, Virginia Tech)
By Technical Paper Link - 18 Dec, 2022 - Comments: 0

A technical paper titled "Fuzzing Hardware Like Software" was published by researchers at University of Michigan, Google and Virginia Tech. The paper was presented at the 2022 Usenix Security Symposium. Abstract: "Hardware flaws are permanent and potent: hardware cannot be patched once fabricated, and any flaws may undermine even formally verified software executing on top. Consequently, ve... » read more

Chip Industry’s Technical Paper Roundup: Nov. 21
By Linda Christensen - 21 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

Profile-Guided HW/SW Mechanism To Efficiently Reduce Branch Mispredictions In Data Center Applications (Best Paper Award)
By Technical Paper Link - 17 Nov, 2022 - Comments: 0

A new technical paper titled "Whisper: Profile-Guided Branch Misprediction Elimination for Data Center Applications" was published by researchers at University of Michigan, ARM, University of California, Santa Cruz, and Texas A&M University. This work was awarded a best paper award at October's 2022 Institute of Electrical and Electronics Engineers (IEEE)/Association for Computing Machin... » read more

Chip Industry’s Technical Paper Roundup: Nov. 15
By Linda Christensen - 15 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=63 /] » read more

Red MicroLEDs Three Orders of Magnitude Smaller in Surface Area
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A technical paper titled "N-polar InGaN/GaN nanowires: overcoming the efficiency cliff of red-emitting micro-LEDs" was published by researchers at University of Michigan. The researchers created "red-microLEDs that are nearly three orders of magnitude smaller in surface area than previously reported devices while exhibiting external quantum efficiency of ~1.2%," according to the University o... » read more

Chip Industry’s Technical Paper Roundup: Oct 25
By Linda Christensen - 25 Oct, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=59 /] » read more

Nonvolatile ECRAM With A Short-Circuit Retention Time Several Orders of Magnitude Higher Than Previously Shown
By Technical Paper Link - 18 Oct, 2022 - Comments: 0

A new technical paper titled "Nonvolatile Electrochemical Random-Access Memory Under Short Circuit" was published by researchers at University of Michigan and Sandia National Laboratories. Abstract "Electrochemical random-access memory (ECRAM) is a recently developed and highly promising analog resistive memory element for in-memory computing. One longstanding challenge of ECRAM is attainin... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 23 Sep, 2022 - Comments: 0

On Sunday, a 6.8-magnitude earthquake struck the southeast region of Taiwan, causing devastation. TSMC officials reported “no known significant impact for now.” Market research firm TrendForce arrived at a similar conclusion based on its analysis of individual fabs. The Biden administration announced appointment of the leadership team charged with implementing the US CHIPS and Science Ac... » read more

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