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Research Bits: Aug. 30


Through glass vias Researchers from the Chinese Academy of Sciences (CAS) developed a Through Glass Via (TGV) process for 3D advanced packaging, which they say enables low transmission loss and high vacuum wafer-level packaging of high-frequency chips and MEMS sensors. TGV is a vertical interconnection technology applied in wafer-level vacuum packaging. The researchers found that it has goo... » read more

Technical Paper Round-Up: March 22


New memories, materials, and transistor types, and processes for making those devices, highlighted the past week's technical papers. That includes everything from vertical MoS2 to programmable black phosphorus image sensors and photonic lift-off processes for flexible thin-film materials. Papers continue to flow from all parts of the supply chain, with some new studies out of Pakistan, Seoul... » read more

Enhanced on-chip phase measurement by inverse weak value amplification


Abstract: "Optical interferometry plays an essential role in precision metrology such as in gravitational wave detection, gyroscopes, and environmental sensing. Weak value amplification enables reaching the shot-noise-limit of sensitivity, which is difficult for most optical sensors, by amplifying the interferometric signal without amplifying certain technical noises. We implement a generali... » read more

Research Bits: March 15


Interferometer on chip Researchers at the University of Rochester developed an optical interferometer on a 2mm by 2mm integrated photonic chip that is capable of amplifying interferometric signals without a corresponding increase in extraneous noise. Interferometers merge two or more sources of light to create interference patterns that provide information able what they illuminate. “If y... » read more

TimeCache: Using Time to Eliminate Cache Side Channels when Sharing Software


"Abstract—Timing side channels have been used to extract cryptographic keys and sensitive documents even from trusted enclaves. Specifically, cache side channels created by reuse of shared code or data in the memory hierarchy have been exploited by several known attacks, e.g., evict+reload for recovering an RSA key and Spectre variants for leaking speculatively loaded data. In this paper, we ... » read more

Manufacturing Bits: Feb. 8


Metalens for AR/VR The Harvard John A. Paulson School of Engineering and Applied Sciences has developed a new lens technology for use in next-generation virtual and augmented reality systems. Researchers have developed a so-called metalens technology. The two-millimeter achromatic metalens is capable of focusing the RGB (red, green, blue) colors at once without any aberrations. Today, s... » read more

Manufacturing Bits: Nov. 3


Zeptosecond measurements A group of researchers have set a new world’s record for the shortest timespan measurement. DESY, Fritz-Haber-Institute and Goethe University Frankfurt have measured how long it takes for a photon to cross a hydrogen molecule. The result? About 247 zeptoseconds. A zeptosecond is a trillionth of a billionth of a second (10-21 seconds). This is said to be the sh... » read more

Power/Performance Bits: Oct. 27


Room-temp superconductivity Researchers at the University of Rochester, University of Nevada Las Vegas, and Intel created a material with superconducting properties at room temperature, the first time this has been observed. The researchers combined hydrogen with carbon and sulfur to photochemically synthesize simple organic-derived carbonaceous sulfur hydride in a diamond anvil cell, which... » read more

Power/Performance Bits: Oct. 20


Benchmarking quantum layout synthesis Computer scientists at the University of California Los Angeles found that current compilers for quantum computers are inhibiting optimal performance and argue that better quantum compilation design could help improve computation speeds up to 45 times. The team designed a family of benchmark quantum circuits with known optimal depths or sizes, which cou... » read more

Week in Review: IoT, Security, Autos


Products/Services Arm released a survey of 650 industry representatives about eSIM and iSIM technology. Ninety percent of the respondents were aware of eSIM, while 43% were unaware of iSIM. Vincent Korstanje, vice president and general manager, Emerging Businesses at Arm, cites the leading three obstacles to large commercial deployments: Resistance from traditional stakeholders (69% of respond... » read more

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