Chip Industry Technical Paper Roundup: Nov. 11


New technical papers recently added to Semiconductor Engineering’s library: [table id=381 /] More Reading Technical Paper Library » read more

Review of Advances in 3D integration of 2D Neuromorphic Electronics, Materials to Systems


A new technical paper titled "2D materials-based 3D integration for neuromorphic hardware" was published by researchers at  Seoul National University and University of Southern California. Find the technical paper here. November 2024. Kim, S.J., Lee, HJ., Lee, CH. et al. 2D materials-based 3D integration for neuromorphic hardware. npj 2D Mater Appl 8, 70 (2024). https://doi.org/10.10... » read more

Chip Industry Week In Review


Arm joined forces with Korea's Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung's 2nm gate-all-around technology. Intel and AMD, arch competitors for decades, formed an x86 ecosystem advisory group to collaborate on architectural interoperability and simplify software development. Samsung... » read more

Research Bits: Aug. 13


3D X-ray of chip interiors Researchers from the Paul Scherrer Institute, EPFL Lausanne, ETH Zurich, and the University of Southern California used X-rays to take non-destructive, three-dimensional images of the inside of a microchip at 4 nanometer resolution. To create the images, the researchers relied on a technique called ptychography, in which a computer combines many individual images ... » read more

Roadmap To Neuromorphic Computing (Collaboration of 27 Universities/Companies)


A technical paper titled “Roadmap to Neuromorphic Computing with Emerging Technologies” was published by researchers at University College London, Politecnico di Milano, Purdue University, ETH Zurich and numerous other institutions. Summary: "The roadmap is organized into several thematic sections, outlining current computing challenges, discussing the neuromorphic computing approach, ana... » read more

Research Bits: May 28


Nanofluidic memristive neural networks Engineers from EPFL developed a functional nanofluidic memristive device that relies on ions, rather than electrons and holes, to compute and store data. “Memristors have already been used to build electronic neural networks, but our goal is to build a nanofluidic neural network that takes advantage of changes in ion concentrations, similar to living... » read more

Chip Industry Technical Paper Roundup: Mar. 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=205 /] More ReadingTechnical Paper Library home » read more

A Hypermultiplexed Integrated Tensor Optical Processor (USC, MIT et al.)


A technical paper titled “Hypermultiplexed Integrated Tensor Optical Processor” was published by researchers at the University of Southern California, Massachusetts Institute of Technology (MIT), City University of Hong Kong, and NTT Research. Abstract: "The escalating data volume and complexity resulting from the rapid expansion of artificial intelligence (AI), internet of things (IoT) a... » read more

A Survey Of Recent Advances In Spiking Neural Networks From Algorithms To HW Acceleration


A technical paper titled “Recent Advances in Scalable Energy-Efficient and Trustworthy Spiking Neural networks: from Algorithms to Technology” was published by researchers at Intel Labs, University of California Santa Cruz, University of Wisconsin-Madison, and University of Southern California. Abstract: "Neuromorphic computing and, in particular, spiking neural networks (SNNs) have becom... » read more

Technical Paper Roundup: Sept 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=136 /] (more…) » read more

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