tag: University of Southern California

Novel In-Pixel-in-Memory (P2M) Paradigm for Edge Intelligence (USC)
By Technical Paper Link - 24 Aug, 2022 - Comments: 0

A new technical paper titled "A processing-in-pixel-in-memory paradigm for resource-constrained TinyML applications" was published by researchers at University of Southern California (USC). According to the paper, "we propose a novel Processing-in-Pixel-in-memory (P2M) paradigm, that customizes the pixel array by adding support for analog multi-channel, multi-bit convolution, batch normaliza... » read more

Week In Review: Design, Low Power
By Jesse Allen - 12 Aug, 2022 - Comments: 0

Infineon acquired Industrial Analytics, a provider of AI-enabled industrial equipment monitoring. Its solution can monitor plants for early detection of critical developments, based on analysis and evaluation of vibrations, and evaluate data for both predictive and prescriptive maintenance. "Industrial Analytics has outstanding expertise in the area of predictive analysis for industrial machine... » read more

Manufacturing Bits: Nov. 8
By Mark LaPedus - 08 Nov, 2021 - Comments: 0

Plasma R&D with quantum computing Rigetti Computing, a developer of quantum computers, has been selected to lead a quantum simulation project for the development of fusion energy. The project was awarded by the Department of Energy (DoE). Under the plan, Rigetti will collaborate with Lawrence Livermore National Laboratory and the University of Southern California on a three-year, $3.1 m... » read more

Manufacturing Bits: Oct. 26
By Mark LaPedus - 26 Oct, 2021 - Comments: 0

GaN finFETs, scaling GaN At the upcoming IEEE International Electron Devices Meeting (IEDM) in San Francisco, a slew of entities will present papers on the latest technologies in R&D. The event, to be held Dec. 11–15, involve papers on advanced packaging, CMOS image sensors, interconnects, transistors, power devices and other technologies. At IEDM, Intel will present a paper on a GaN-... » read more

FORMS: Fine-grained Polarized ReRAM-based In-situ Computation for Mixed-signal DNN Accelerator
By Technical Paper Link - 19 Aug, 2021 - Comments: 0

Abstract: "Recent work demonstrated the promise of using resistive random access memory (ReRAM) as an emerging technology to perform inherently parallel analog domain in-situ matrix-vector multiplication—the intensive and key computation in deep neural networks (DNNs). One key problem is the weights that are signed values. However, in a ReRAM crossbar, weights are stored as conductance of... » read more

Manufacturing Bits: June 1
By Mark LaPedus - 01 Jun, 2021 - Comments: 0

Frozen finFETs The Defense Advanced Research Projects Agency (DARPA) has launched the Low Temperature Logic Technology (LTLT) program, an effort to develop finFETs that operate at temperatures close to liquid nitrogen (~77K or minus 321 degrees Fahrenheit). The goal of LTLT is to develop low-temperature finFET transistors at the 14nm node and below by making modifications to the manufacturi... » read more

Power/Performance Bits: Dec. 16
By Jesse Allen - 16 Dec, 2019 - Comments: 0

Carbon nanotubes for RF Researchers at Carbonics, Inc., University of Southern California, and King Abdulaziz City for Science and Technology, funded by the Army Research Office, propose using carbon nanotubes for radio frequency applications. The team's carbon nanotube device beat traditional RF-CMOS technology, achieved speeds exceeding 100GHz. This could boost mmWave, which in turn would... » read more

Power/Performance Bits: Oct. 29
By Jesse Allen - 29 Oct, 2019 - Comments: 0

Chip scanning Researchers at the University of Southern California and the Paul Scherer Institut in Switzerland developed an x-ray technique to non-destructively scan chips to make sure they conform to specifications. Such a system could be used to identify manufacturing defects or malicious alterations, the team said. Called ptychographic x-ray laminography, the technique utilizes x-rays f... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 27 Sep, 2019 - Comments: 0

Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

Manufacturing Bits: July 10
By Mark LaPedus - 10 Jul, 2019 - Comments: 0

Semicon West It’s Semicon West time again. Here’s the first wave of announcements at the event: Applied Materials has unveiled a pair of tools aimed at accelerating the industry adoption for new memories. First, Applied rolled out the Endura Clover MRAM PVD system. The system is an integrated platform for MRAM devices. Second, the company introduced the Endura Impulse PVD platform for P... » read more

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